Package Intersil W5x5.25G — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x5.25G
5x5 ARRAY 25 BALLS WITH 0.4mm PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 12/16
X
2.34 В±0.030 Y 0.400 E
25X 0.265 В±0.035 D
C 2.38 В±0.030 B
A
(4X) 0.390 0.10
1 PIN 1
(A1 CORNER) 2 3 4 5 0.0
0.370 TOP VIEW
BOTTOM VIEW 0.05 Z SEATING PLANE
3 PACKAGE
OUTLINE 0.215 Z 0.265 0.265 В±0.035 0.400 0.10
0.05 4
Z X Y
Z
5 0.200 В±0.030
6. NSMD RECOMMENDED LAND PATTERN 0.500 В±0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters. …