Package Intersil W4x7.28 — 数据表

制造商Intersil
系列WLCSP
零件号W4x7.28
Package Intersil W4x7.28

28球晶圆级芯片封装(WLCSP 0.4mm间距)

Package Outline Drawing (POD)

PDF, 156 Kb
从文件中提取

参数化

FamilyWLCSP-BP
Pin Count28
Length2.86 mm
Width1.66 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X7.28

模型线

制造商分类

  • Plastic Packages