Package Intersil W11x11.121 — 数据表

制造商Intersil
系列WLCSP
零件号W11x11.121
Package Intersil W11x11.121

121球晶圆级芯片封装(WLCSP 0.5mm间距)

Package Outline Drawing (POD)

PDF, 104 Kb
从文件中提取

参数化

FamilyWLCSP-TCURDL
Pin Count121
Length5.46 mm
Width5.46 mm
Thickness0.36 mm
Height max0.66 mm
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW11X11.121

模型线

制造商分类

  • Plastic Packages