Package Intersil W11x11.121B — 数据表

制造商Intersil
系列WLCSP
零件号W11x11.121B
Package Intersil W11x11.121B

121球晶圆级芯片封装(WLCSP 0.5mm间距)

Package Outline Drawing (POD)

PDF, 172 Kb
从文件中提取

参数化

FamilyWLCSP-TCURDL
Pin Count121
Length5.54 mm
Width5.53 mm
Thickness0.36 mm
Height max0.66 mm
Weight0.03786375 g
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW11X11.121B

模型线

制造商分类

  • Plastic Packages