Package Intersil W2x2.4 — 数据表

制造商Intersil
系列WLCSP
零件号W2x2.4
Package Intersil W2x2.4

4球晶圆级芯片级封装(WLCSP 0.4mm间距)

Package Outline Drawing (POD)

PDF, 87 Kb
从文件中提取

参数化

FamilyWLCSP-BP
Pin Count4
Length1.02 mm
Width1.20 mm
Thickness0.31 mm
Height max0.55 mm
Weight0.00104 g
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW2X2.4

模型线

制造商分类

  • Plastic Packages