Package Intersil W3x4.12C — 数据表

制造商Intersil
系列WLCSP
零件号W3x4.12C
Package Intersil W3x4.12C

12球晶圆级芯片封装(WLCSP 0.40mm间距)

Package Outline Drawing (POD)

PDF, 113 Kb
从文件中提取

参数化

FamilyWLCSP-BP
Pin Count12
Length1.69 mm
Width1.39 mm
Thickness0.01 mm
Height max0.02 mm
Weight0.0040 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12C

模型线

制造商分类

  • Plastic Packages