Package Intersil W4x4.16E — 数据表

制造商Intersil
系列WLCSP
零件号W4x4.16E
Package Intersil W4x4.16E

具有0.40节距晶圆级芯片规模封装的4x4阵列16球

Package Outline Drawing (POD)

PDF, 111 Kb
从文件中提取

参数化

FamilyWLCSP-TKCURDLBC
Pin Count16
Length1.78 mm
Width1.78 mm
Thickness0.01 mm
Height max0.02 mm
Weight0.0034 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW4X4.16E

模型线

制造商分类

  • Plastic Packages