Package Intersil W4x5.20B — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20B
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 2, 9/12
1.200 X
1.82В±0.03 PIN 1
(A1 CORNER) Y 0.400 A
0.400
B 20x 0.265 В± 0.03 C 2.15В±0.03 1.600 D
E
(2X) 0.10
4 3 2 1 0.200
TOP VIEW
BOTTOM VIEW Z
0.05 Z SEATING PLANE
3 PACKAGE OUTLINE
0.225 0.305 В± 0.025 0.400 0.265В±0.035 0.275 0.15
0.05 ZXY
Z 0.200В±0.03
0.500В±0.045
TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter …