Package Intersil W4x4.16E — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x4.16E
4X4 ARRAY 16 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
Rev 0, 2/13
X 1.200 1.780В±0.030 Y D
C 16x 0.265В±0.035 1.780В±0.030 0.200 B
0.400
A
0.290
1 0.10 TOP VIEW (4X) 3 4 BOTTOM VIEW PIN 1
(A1 CORNER) 0.240 2 0.290 PACKAGE
OUTLINE 0.400 0.040 BSC
(BACK SIDE COATING)
0.290 0.540В±0.050
0.05
3 NSMD 0.200В±0.030 0.265В±0.035 Z Z SEATING
PLANE TYPICAL RECOMMENDED LAND PATTERN
0.10
0.05 ZXY
Z
SIDE VIEW NOTES: 1 1. All dimensions are in millimeters. 2. Dimension and tolerance conform to ASMEY14.5-1994,
and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per
Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf …