Package Intersil W3x2.6 — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x2.6
3X2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLSCP 0.4MM PITCH)
Rev 3, 1/13 X
1.360В±0.03 Y 0.280
0.200 0.800
2 0.800В±0.03
0.10
PIN 1
(A1 CORNER) 1 0.400 0.200
A
B
6X 0.265В±0.035 C TOP VIEW BOTTOM VIEW PACKAGE
OUTLINE
4
0.240
0.400 SEATING PLANE
3 0.10
0.05 2 0.200В±0.030 0.05 Z
0.290
6 0.500В±0.050 NSMD TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter …