Package Intersil W2x2.4 — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
W2x2.4
4 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
Rev 3, 5/15 X 0.975
В±0.020 Y 0.400 B 1.155
В±0.020
4x 0.265В±0.035
(4x) 0.10 PIN 1
(A1 CORNER) 0.3775 A 1 2 0.2875 TOP VIEW BOTTOM VIEW Z
0.05 Z SEATING PLANE
3 PACKAGE OUTLINE
0.240 0.265В±0.035 x4
0.10
0.05 0.400 ZXY
Z 0.290 0.200В±0.030 TYPICAL RECOMMENDED LAND PATTERN
0.500В±0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5-1994 and JESD 95-1
SPP-010.
3. NSMD refers to non-solder mask defined pad design per Intersil
Techbrief www.intersil.com/data/tb/tb451.pdf 1 …