LAN8023TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we wil continue to improve our publications to better suit your needs. Our pub- lications wil be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bot om outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of doc- ument DS30000). Errata An errata sheet, describing minor operational dif erences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we wil publish an errata sheet. The errata wil specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the fol owing: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales of ice (see last page) When contacting a sales of ice, please specify which device, revision of silicon and data sheet (include literature num- ber) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on al of our products. DS00006161B-page 2 2025 Microchip Technology Inc. and its subsidiaries Document Outline Table of contents 1.0 Introduction 1.1 General Description 2.0 Pin Descriptions 2.1 Pin Assignments 2.2 Pin Descriptions 2.3 Buffer Types 3.0 Functional Descriptions 3.1 IEEE 802.3 Alignment 3.2 Data Path Overview 3.2.1 Operating Modes 3.2.2 PTP 3.2.3 SerDEs 3.2.4 PCS25G 3.2.5 1G PCS 3.2.6 Cross Connect 3.2.7 1588 TSU 3.2.8 MAC 3.2.9 Flow Control Buffer 3.2.10 Loopbacks and Packet BIST 3.3 Frame Preemption Verify/Respond System Operation 3.4 Link Fault Signaling System Operation 3.5 Flow Control System Operation 3.5.1 Pause Handling and Flow Control 3.5.2 Basic Flow Control Handling 3.5.3 Advanced Flow Control Handling 3.6 Auto-negotiation and Training 3.6.1 25G Technology Ability 3.7 IEEE 1588 Operation 3.7.1 Implementation 3.7.2 1588 PLL 3.7.3 1588 LTC 3.7.4 Waveform Generator Output 3.7.5 Serial Timestamp Interface (STI) 3.7.6 Time Stamp Unit (TSU) 3.8 Clocking 3.8.1 Data Path Clocking 3.8.2 System Clock Generation 3.8.3 Synchronous Ethernet and Recovered Clocks 3.9 Device Management 3.9.1 SPI Client Interface 3.9.2 Management Data Input/Output (MDIO) Interface 3.10 Fiber Modules and Management 3.10.1 Two-Wire Interface 3.10.2 Fiber Module Support 3.11 LEDs 3.12 GPIOs 3.12.1 GPIO Interrupts 3.13 Resets and Power-On Self-Test 3.13.1 Resets 3.14 Host Interrupts 3.15 JTAG 3.15.1 Test TAP Controller 3.15.2 Test Modes 3.15.3 CSR Ring Access 3.15.4 Boundary Scan 3.16 Miscellaneous 3.16.1 Power Management 3.16.2 Warm ReSTART 3.16.3 Temperature Sensor 3.17 Configuration Straps 3.17.1 Function Mode Straps 4.0 Operational Characteristics 4.1 Absolute Maximum Ratings* 4.2 Operating Conditions** 4.3 Package Thermal Specifications 4.3.1 256-BGA 4.4 Power Consumption 4.4.1 Worst Case TWO Port Operation 4.4.2 Typical Usage TWO Port Operation 4.5 DC Specifications 4.5.1 SYSREFCK And LREFCK Clock Inputs DC Electrical Characteristics 4.5.2 SerDes DC Electrical Characteristics 4.6 AC Specifications 4.6.1 Power Sequencing 4.6.2 SYSREFCK And LREFCK Clock Inputs AC Electrical Characteristics 4.6.3 SerDes AC Electrical Characteristics 4.6.4 TWI Host Timing 4.6.5 MDC/MDIO Client 4.6.6 SPI Client 4.6.7 PPS and LSC Inputs/Outputs 4.6.8 Serial Timestamp Interface (STI) Format & Timing 4.6.9 Recovered Clock Timing Requirements 4.6.10 Reset Pin Configuration Strap Timing 4.6.11 JTAG Timing Values 5.0 Package Information 5.1 Top Marking 5.2 256-BGA Appendix A: Data Sheet Revision History Product Identification System The Microchip Web Site Customer Change Notification Service Customer Support