Datasheet J111, J112, J113, MMBFJ111, MMBFJ112, MMBFJ113 (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | N-Channel Switch |
| 页数 / 页 | 9 / 1 — DATA SHEET. www.onsemi.com. TO−92 3 4.83x4.76 LEADFORMED. CASE 135AR. … |
| 文件格式/大小 | PDF / 240 Kb |
| 文件语言 | 英语 |
DATA SHEET. www.onsemi.com. TO−92 3 4.83x4.76 LEADFORMED. CASE 135AR. Features. TO−92 3 4.825x4.76. CASE 135AN
该数据表的模型线
文件文字版本
link to page 1 link to page 1 link to page 1 link to page 1 link to page 6
DATA SHEET www.onsemi.com
N-Channel Switch J111, J112, J113, MMBFJ111, MMBFJ112, D S MMBFJ113 G
TO−92 3 4.83x4.76 LEADFORMED CASE 135AR Features
• This Device is Designed for Low Level Analog Switching, Sample and Hold Circuits and Chopper Stabilized Amplifiers • Sourced from Process 51 D • Source & Drain are Interchangeable SG • These are Pb−Free Devices
TO−92 3 4.825x4.76 CASE 135AN ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted) G (Note 1, 2)
Symbol Parameter Value Unit
D S VDG Drain−Gate Voltage 35 V
SOT−23 (TO−236)
VGS Gate−Source Voltage −35 V
CASE 318−08
IGF Forward Gate Current 50 mA G TJ, TSTG Operating and Storage Junction −55 to 150 °C Temperature Range D Stresses exceeding those listed in the Maximum Ratings table may damage the S device. If any of these limits are exceeded, device functionality should not be
SOT−23
assumed, damage may occur and reliability may be affected.
CASE 318BM
1. These ratings are based on a maximum junction temperature of 150°C. 2. These are steady−state limits. ON Semiconductor should be consulted on applications involving pulsed or low−duty−cycle operations.
MARKING DIAGRAMS THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise noted) AX
Max
XXX XXM YWW
MMBFJ111 / J111 / J112 / MMBFJ112 /
1
J113 MMBFJ113 Symbol Parameter
(Note 3) (Note 4)
Unit
XXXX, XX = Specific Device Code PD Total Device Dissipation 625 350 mW A = Assembly Plant Code Derate Above 25_C 5.0 2.8 mW/°C Y = Year WW = Work Week RqJC Thermal Resistance, 125 − °C/W M = Date Code Junction−to−Case RqJA Thermal Resistance, 200 357 °C/W
ORDERING INFORMATION
Junction−to−Ambient See detailed ordering and shipping information on page 6 of 3. PCB size: FR−4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) this data sheet. with minimum land pattern size. 4. Device mounted on FR−4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for the collector lead minimum 6 cm2. © Semiconductor Components Industries, LLC, 1997
1
Publication Order Number:
March, 2023 − Rev. 5 MMBFJ113/D
DATA SHEET www.onsemi.com
N-Channel Switch J111, J112, J113, MMBFJ111, MMBFJ112, D S MMBFJ113 G
TO−92 3 4.83x4.76 LEADFORMED CASE 135AR Features
• This Device is Designed for Low Level Analog Switching, Sample and Hold Circuits and Chopper Stabilized Amplifiers • Sourced from Process 51 D • Source & Drain are Interchangeable SG • These are Pb−Free Devices
TO−92 3 4.825x4.76 CASE 135AN ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted) G (Note 1, 2)
Symbol Parameter Value Unit
D S VDG Drain−Gate Voltage 35 V
SOT−23 (TO−236)
VGS Gate−Source Voltage −35 V
CASE 318−08
IGF Forward Gate Current 50 mA G TJ, TSTG Operating and Storage Junction −55 to 150 °C Temperature Range D Stresses exceeding those listed in the Maximum Ratings table may damage the S device. If any of these limits are exceeded, device functionality should not be
SOT−23
assumed, damage may occur and reliability may be affected.
CASE 318BM
1. These ratings are based on a maximum junction temperature of 150°C. 2. These are steady−state limits. ON Semiconductor should be consulted on applications involving pulsed or low−duty−cycle operations.
MARKING DIAGRAMS THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise noted) AX
Max
XXX XXM YWW
MMBFJ111 / J111 / J112 / MMBFJ112 /
1
J113 MMBFJ113 Symbol Parameter
(Note 3) (Note 4)
Unit
XXXX, XX = Specific Device Code PD Total Device Dissipation 625 350 mW A = Assembly Plant Code Derate Above 25_C 5.0 2.8 mW/°C Y = Year WW = Work Week RqJC Thermal Resistance, 125 − °C/W M = Date Code Junction−to−Case RqJA Thermal Resistance, 200 357 °C/W
ORDERING INFORMATION
Junction−to−Ambient See detailed ordering and shipping information on page 6 of 3. PCB size: FR−4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) this data sheet. with minimum land pattern size. 4. Device mounted on FR−4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for the collector lead minimum 6 cm2. © Semiconductor Components Industries, LLC, 1997
1
Publication Order Number:
March, 2023 − Rev. 5 MMBFJ113/D