Datasheet DB3, DB4, SMDB3 (STMicroelectronics) - 8
| 制造商 | STMicroelectronics |
| 描述 | DIAC |
| 页数 / 页 | 11 / 8 — DB3, DB4, SMDB3. DO-35 package information. 2.2. Figure 9. DO-35 package … |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
DB3, DB4, SMDB3. DO-35 package information. 2.2. Figure 9. DO-35 package outline. Table 4. DO-35 package mechanical data
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文件文字版本
DB3, DB4, SMDB3 DO-35 package information 2.2 DO-35 package information Figure 9. DO-35 package outline
C A C ØD ØB
Table 4. DO-35 package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max.
A 3.05 4.50 0.120 0.177 B 1.53 2.00 0.060 0.079 C 28.00 31.00 1.102 1.220 D 0.46 0.55 0.018 0.022
DS2125
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Rev 3 page 8/11
Document Outline 1 Characteristics 1.1 Characteristics curves 2 Package information 2.1 SOT23 package information 2.2 DO-35 package information 3 Ordering information Revision history
C A C ØD ØB
Table 4. DO-35 package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max.
A 3.05 4.50 0.120 0.177 B 1.53 2.00 0.060 0.079 C 28.00 31.00 1.102 1.220 D 0.46 0.55 0.018 0.022
DS2125
-
Rev 3 page 8/11
Document Outline 1 Characteristics 1.1 Characteristics curves 2 Package information 2.1 SOT23 package information 2.2 DO-35 package information 3 Ordering information Revision history