Datasheet PSMN9R0-30YL (Nexperia) - 10
| 制造商 | Nexperia |
| 描述 | N-channel 30 V 8 mΩ logic level MOSFET in LFPAK |
| 页数 / 页 | 14 / 10 — NXP Semiconductors. PSMN9R0-30YL. N-channel 30 V 8 mΩ logic level MOSFET … |
| 修订版 | 10201103 |
| 文件格式/大小 | PDF / 394 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. PSMN9R0-30YL. N-channel 30 V 8 mΩ logic level MOSFET in LFPAK. Package outline
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文件文字版本
NXP Semiconductors PSMN9R0-30YL N-channel 30 V 8 mΩ logic level MOSFET in LFPAK 7. Package outline Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669
A2 E A C b c E 2 2 1 b L 3 1 mounting b base 4 D1 H D L2
1 2 3 4
X e b w M A c 1/2 e A (A ) 3 C A1 θ L detail X y C 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) D (1) UNIT A A A (1) 1 2 A b b b b c c D(1) 1 E(1) E e 3 2 3 4 2 H L L L 1 1 2 w y
θ
max
1.20 0.15 1.10 0.50 4.41 2.2 0.9 0.25 0.30 4.10 5.0 3.3 6.2 0.85 1.3 1.3 8° mm 0.25 4.20 1.27 0.25 0.1 1.01 0.00 0.95 0.35 3.62 2.0 0.7 0.19 0.24 3.80 4.8 3.1 5.8 0.40 0.8 0.8 0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-10-13 SOT669 MO-235 06-03-16
Fig 18. Package outline SOT669 (LFPAK)
PSMN9R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 04 — 9 March 2011 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Package outline 8. Revision history 9. Legal information 9.1 Data sheet status 9.2 Definitions 9.3 Disclaimers 9.4 Trademarks 10. Contact information 11. Contents
A2 E A C b c E 2 2 1 b L 3 1 mounting b base 4 D1 H D L2
1 2 3 4
X e b w M A c 1/2 e A (A ) 3 C A1 θ L detail X y C 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) D (1) UNIT A A A (1) 1 2 A b b b b c c D(1) 1 E(1) E e 3 2 3 4 2 H L L L 1 1 2 w y
θ
max
1.20 0.15 1.10 0.50 4.41 2.2 0.9 0.25 0.30 4.10 5.0 3.3 6.2 0.85 1.3 1.3 8° mm 0.25 4.20 1.27 0.25 0.1 1.01 0.00 0.95 0.35 3.62 2.0 0.7 0.19 0.24 3.80 4.8 3.1 5.8 0.40 0.8 0.8 0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-10-13 SOT669 MO-235 06-03-16
Fig 18. Package outline SOT669 (LFPAK)
PSMN9R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 04 — 9 March 2011 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Package outline 8. Revision history 9. Legal information 9.1 Data sheet status 9.2 Definitions 9.3 Disclaimers 9.4 Trademarks 10. Contact information 11. Contents