Datasheet TDA8920CTH (NXP) - 5

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NXP Semiconductors TDA8920C 2
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110 W class-D power amplifier 7.2 Pin description Table 3. Pin description Symbol Pin Description TDA8920CTH TDA8920CJ
VSSA 1 18 negative analog supply voltage SGND 2 19 signal ground VDDA 3 20 positive analog supply voltage IN2M 4 21 channel 2 negative audio input IN2P 5 22 channel 2 positive audio input MODE 6 23 mode selection input: Standby, Mute or Operating mode OSC 7 1 oscillator frequency adjustment or tracking input IN1P 8 2 channel 1 positive audio input IN1M 9 3 channel 1 negative audio input n.c. 10 4 not connected n.c. 11 5 not connected n.c. 12 6 not connected PROT 13 7 decoupling capacitor for protection (OCP) VDDP1 14 8 channel 1 positive power supply voltage BOOT1 15 9 channel 1 bootstrap capacitor OUT1 16 10 channel 1 PWM output VSSP1 17 11 channel 1 negative power supply voltage STABI 18 12 decoupling of internal stabilizer for logic supply n.c. 19 - not connected VSSP2 20 13 channel 2 negative power supply voltage OUT2 21 14 channel 2 PWM output BOOT2 22 15 channel 2 bootstrap capacitor VDDP2 23 16 channel 2 positive power supply voltage VSSD 24 17 negative digital supply voltage
8. Functional description 8.1 General
The TDA8920C is a two-channel audio power amplifier that uses class-D technology. For each channel, the audio input signal is converted into a digital PWM signal using an analog input stage and a PWM modulator; see Figure 1. To drive the output power transistors, the digital PWM signal is fed to a control and handshake block and to high- and low-side driver circuits. This level-shifts the low-power digital PWM signal from a logic level to a high-power PWM signal switching between the main supply lines. A 2nd-order low-pass filter converts the PWM signal to an analog audio signal that can be used to drive a loudspeaker. TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 5 of 39
Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents