Datasheet TDA8920CTH (NXP) - 4
| 制造商 | NXP |
| 描述 | 2 x 110 W Class-D Power Amplifier |
| 页数 / 页 | 39 / 4 — NXP Semiconductors. TDA8920C. 110 W class-D power amplifier. Pinning … |
| 文件格式/大小 | PDF / 237 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. TDA8920C. 110 W class-D power amplifier. Pinning information. 7.1 Pinning. TDA8920CJ. TDA8920CTH. Fig 2
该数据表的模型线
文件文字版本
NXP Semiconductors TDA8920C 2
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110 W class-D power amplifier 7. Pinning information 7.1 Pinning
OSC 1 IN1P 2 IN1M 3 n.c. 4 n.c. 5 n.c. 6 PROT 7 VDDP1 8 BOOT1 9 OUT1 10 VSSP1 11 VSSD 24 1 VSSA STABI 12
TDA8920CJ
VDDP2 23 2 SGND VSSP2 13 BOOT2 22 3 VDDA OUT2 14 OUT2 21 4 IN2M BOOT2 15 VSSP2 20 5 IN2P VDDP2 16 n.c. 19 6 MODE VSSD 17
TDA8920CTH
STABI 18 7 OSC VSSA 18 VSSP1 17 8 IN1P SGND 19 OUT1 16 9 IN1M VDDA 20 BOOT1 15 10 n.c. IN2M 21 VDDP1 14 11 n.c. IN2P 22 PROT 13 12 n.c. MODE 23 001aai853 001aai854
Fig 2. Pin configuration TDA8920CTH Fig 3. Pin configuration TDA8920CJ
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 4 of 39
Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents
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110 W class-D power amplifier 7. Pinning information 7.1 Pinning
OSC 1 IN1P 2 IN1M 3 n.c. 4 n.c. 5 n.c. 6 PROT 7 VDDP1 8 BOOT1 9 OUT1 10 VSSP1 11 VSSD 24 1 VSSA STABI 12
TDA8920CJ
VDDP2 23 2 SGND VSSP2 13 BOOT2 22 3 VDDA OUT2 14 OUT2 21 4 IN2M BOOT2 15 VSSP2 20 5 IN2P VDDP2 16 n.c. 19 6 MODE VSSD 17
TDA8920CTH
STABI 18 7 OSC VSSA 18 VSSP1 17 8 IN1P SGND 19 OUT1 16 9 IN1M VDDA 20 BOOT1 15 10 n.c. IN2M 21 VDDP1 14 11 n.c. IN2P 22 PROT 13 12 n.c. MODE 23 001aai853 001aai854
Fig 2. Pin configuration TDA8920CTH Fig 3. Pin configuration TDA8920CJ
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 4 of 39
Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents