Datasheet SID11x2KQ SCALE-iDriver Family (Power Integrations) - 19
| 制造商 | Power Integrations |
| 描述 | Up to 8 A Single Channel IGBT/MOSFET Gate Driver for Automotive Applications Providing Reinforced Galvanic Isolation up to 1200 V Blocking Voltage |
| 页数 / 页 | 22 / 19 — SID11x2KQ. eSOP-R16B. 0.004 [0.10] C A. 3 4. 0.057 [1.45] Ref. 0.023 … |
| 文件格式/大小 | PDF / 1.7 Mb |
| 文件语言 | 英语 |
SID11x2KQ. eSOP-R16B. 0.004 [0.10] C A. 3 4. 0.057 [1.45] Ref. 0.023 [0.58] 13X. 0.050 [1.27]. 0.018 [0.46]. 0.010 [0.25] M C A B
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文件文字版本
SID11x2KQ eSOP-R16B 2X 0.004 [0.10] C A 3 4 0.057 [1.45] Ref. 0.023 [0.58] 13X 0.050 [1.27] 0.018 [0.46] 2 0.010 [0.25] M C A B A 0.400 [10.16] 8 Lead Tips H 16 9 0.006 [0.15] C 9 10 11 12 13 14 15 16 2X 0.010 [0.25] 0.004 [0.10] C B Gauge Plane Seating Plane 0.059 [1.50] 0
°
- 8
°
C 2 Ref. Typ. 0.040 [1.02] 0.350 [8.89] 0.464 [11.79] 0.028 [0.71] 0.059 [1.50] Ref. Typ. DETAIL A B 0.020 [0.51] 1 8 8 7 6 5 4 3 1 0.006 [0.15] C Ref. 0.022 [0.56] Ref. 0.010 [0.24] 4 Lead Tips 3 4 0.019 [0.48] Pin #1 I.D. 0.158 [4.01] Ref. Ref. (Laser Marked) 0.045 [1.14] Ref. 0.152 [3.86] 0.080 [2.03] Ref. 0.032 [0.81] 0.028 [0.71] 0.029 [0.74] TOP VIEW BOTTOM VIEW Ref. 0.010 [0.25] Ref. 0.356 [9.04]Ref. Detail A 0.306 [7.77] Ref. 7 0.049 [1.23] .028 [0.71] .050 [1.27] 0.105 [2.67] 0.046 [1.16] 0.093 [2.36] 3 0.016 [0.41] 0.011 [0.28] 12X Seating Plane C .070 [1.78] 0.012 [0.30] 0.092 [2.34] .460 [11.68] 0.004 [0.10] 0.086 [2.18] 0.004 [0.10] C Seating Plane to 12 Leads Molded Bumps Reference Standoff Solder Pad SIDE VIEW END VIEW Dimensions .162 [4.11] Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. .165 [4.19] 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and inter-lead flash, but including any mismatch between the top .300 [7.62] and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. INCH [mm] .350 [8.89] 3. Dimensions noted are inclusive of plating thickness. 4. Does not include inter-lead flash or protrusions. 5. Controlling dimensions in inches [mm]. 6. Datums A and B to be determined in Datum H. 7. Exposed metal at the plastic package body outline/surface between leads 6 and 7, connected
PI-6995-051716
internally to wide lead 3/4/5/6.
POD-eSOP-R16B Rev B
19
Rev. C 09/19 www.power.com Document Outline Product Highlights Description Scale-iDriver − Product Portfolio Pin Functional Description SCALE-iDriver Functional Description Application Examples and Components Selection Power Dissipation and IC Junction Temperature Estimation Absolute Maximum Ratings Thermal Resistance Key Electrical Characteristics Typical Performance Characteristics eSOP-R16B (K Package) MSL Table ESD and Latch-Up Table IEC 60664-1 Rating Table Electrical Characteristics (EMI) Table Regulatory Information Table Part Ordering Information
°
- 8
°
C 2 Ref. Typ. 0.040 [1.02] 0.350 [8.89] 0.464 [11.79] 0.028 [0.71] 0.059 [1.50] Ref. Typ. DETAIL A B 0.020 [0.51] 1 8 8 7 6 5 4 3 1 0.006 [0.15] C Ref. 0.022 [0.56] Ref. 0.010 [0.24] 4 Lead Tips 3 4 0.019 [0.48] Pin #1 I.D. 0.158 [4.01] Ref. Ref. (Laser Marked) 0.045 [1.14] Ref. 0.152 [3.86] 0.080 [2.03] Ref. 0.032 [0.81] 0.028 [0.71] 0.029 [0.74] TOP VIEW BOTTOM VIEW Ref. 0.010 [0.25] Ref. 0.356 [9.04]Ref. Detail A 0.306 [7.77] Ref. 7 0.049 [1.23] .028 [0.71] .050 [1.27] 0.105 [2.67] 0.046 [1.16] 0.093 [2.36] 3 0.016 [0.41] 0.011 [0.28] 12X Seating Plane C .070 [1.78] 0.012 [0.30] 0.092 [2.34] .460 [11.68] 0.004 [0.10] 0.086 [2.18] 0.004 [0.10] C Seating Plane to 12 Leads Molded Bumps Reference Standoff Solder Pad SIDE VIEW END VIEW Dimensions .162 [4.11] Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. .165 [4.19] 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and inter-lead flash, but including any mismatch between the top .300 [7.62] and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. INCH [mm] .350 [8.89] 3. Dimensions noted are inclusive of plating thickness. 4. Does not include inter-lead flash or protrusions. 5. Controlling dimensions in inches [mm]. 6. Datums A and B to be determined in Datum H. 7. Exposed metal at the plastic package body outline/surface between leads 6 and 7, connected
PI-6995-051716
internally to wide lead 3/4/5/6.
POD-eSOP-R16B Rev B
19
Rev. C 09/19 www.power.com Document Outline Product Highlights Description Scale-iDriver − Product Portfolio Pin Functional Description SCALE-iDriver Functional Description Application Examples and Components Selection Power Dissipation and IC Junction Temperature Estimation Absolute Maximum Ratings Thermal Resistance Key Electrical Characteristics Typical Performance Characteristics eSOP-R16B (K Package) MSL Table ESD and Latch-Up Table IEC 60664-1 Rating Table Electrical Characteristics (EMI) Table Regulatory Information Table Part Ordering Information