Datasheet Texas Instruments OMAP3525 — 数据表

制造商	Texas Instruments
系列	OMAP3525

数据表

价格

状态

打包

参数化

Parameters / Models	OMAP3525DCBB	OMAP3525DCBBA	OMAP3525DCBC	OMAP3525DCBCA	OMAP3525DCUS	OMAP3525DCUSA	OMAP3525ECBB	OMAP3525ECBBA	OMAP3525ECBC	OMAP3525ECBCA	OMAP3525ECUS	OMAP3525ECUSA	TNETV3525INECBB
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.							600	600	600	600	600	600	600
ARM MHz (Max.)	600	600	600	600	600	600
Applications	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging	Audio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging
Approx. Price (US$)	29.00 | 1ku	29.00 | 1ku	29.00 | 1ku	29.00 | 1ku	29.00 | 1ku	29.00 | 1ku
DRAM	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR
DSP	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x
DSP MHz, Max.							430	430	430	430	430	430	430
DSP MHz (Max.)	430	430	430	430	430	430
I2C	3	3	3	3	3	3	3	3	3	3	3	3	3
On-Chip L2 Cache	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8) 96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)	256 KB (ARM Cortex-A8),96 KB (DSP)
Operating Systems	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks	Android,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks
Operating Temperature Range, C							-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90
Operating Temperature Range(C)	-40 to 105 0 to 90	-40 to 105 0 to 90	-40 to 105 0 to 90	-40 to 105 0 to 90	-40 to 105 0 to 90	-40 to 105 0 to 90
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	4	4	4	4	4	4	4	4	4	4	4	4	4
UART, SCI							3	3	3	3	3	3	3
UART(SCI)	3	3	3	3	3	3
USB	2	2	2	2	2	2	2	2	2	2	2	2	2
Video Port, Configurable							Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance	Decode,Encode,Analytics,Image Enhance
Video Port (Configurable)	Decode Encode Analytics Image Enhance	Decode Encode Analytics Image Enhance	Decode Encode Analytics Image Enhance	Decode Encode Analytics Image Enhance	Decode Encode Analytics Image Enhance	Decode Encode Analytics Image Enhance

生态计划

应用须知

• 下载
  OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
  PDF, 372 Kb, 修订版: B, 档案已发布: Jun 26, 2008
  It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
• 下载
  OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
  PDF, 27 Kb, 档案已发布: Nov 13, 2009
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

  Reflow profiles are dependent on numerous factors including package type number of components bo

• 下载
  OMAP35x Linux PSP Data Sheet
  PDF, 1.6 Mb, 档案已发布: Oct 16, 2009
• 下载
  Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
  PDF, 181 Kb, 修订版: B, 档案已发布: Mar 2, 2009
• 下载
  OMAP35x to AM35x Hardware Migration Guide
  PDF, 19 Kb, 档案已发布: May 24, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

  This article describes hardware device considerations to migrate a design

• 下载
  OMAP35x to AM37x Hardware Migration Guide
  PDF, 37 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

  The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

• 下载
  PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
  PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
  Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
• 下载
  PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
  PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
  Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

  PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

• 下载
  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
• 下载
  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Mb, 档案已发布: Jun 23, 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

• 下载
  Introduction to TMS320C6000 DSP Optimization
  PDF, 535 Kb, 档案已发布: Oct 6, 2011
  The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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制造商分类

• Semiconductors> Processors> Digital Signal Processors> Media Processors > OMAP Processors