Datasheet Texas Instruments OMAP3525ECBBA — 数据表

制造商Texas Instruments
系列OMAP3525
零件号OMAP3525ECBBA
Datasheet Texas Instruments OMAP3525ECBBA

应用处理器515-POP-FCBGA -40至105

数据表

OMAP3530 and OMAP3525 Applications Processors datasheet
PDF, 2.7 Mb, 修订版: H, 档案已发布: Oct 10, 2013
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin515515
Package TypeCBBCBB
Industry STD TermPOP-FCBGAPOP-FCBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Package QTY168168
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking3525ECBBA
Width (mm)1212
Length (mm)1212
Thickness (mm).61.61
Pitch (mm).4.4
Max Height (mm).9.9
Mechanical Data下载下载

参数化

ARM CPU1 ARM Cortex-A8
ARM MHz600 Max.
ApplicationsAudio,Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical,Security,Space,Avionics and Defense,Video and Imaging
DRAMLPDDR
DSP1 C64x
DSP MHz430 Max.
I2C3
On-Chip L2 Cache256 KB (ARM Cortex-A8),96 KB (DSP)
Operating SystemsAndroid,Neutrino,Integrity,Tornado,Windows Embedded CE,Linux,VxWorks
Operating Temperature Range-40 to 105,0 to 90 C
RatingCatalog
SPI4
UART3 SCI
USB2
Video PortDecode,Encode,Analytics,Image Enhance Configurable

生态计划

RoHSCompliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSEVM3530
    OMAP35x Evaluation Module (EVM)
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
    PDF, 372 Kb, 修订版: B, 档案已发布: Jun 26, 2008
    It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
  • OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
    PDF, 27 Kb, 档案已发布: Nov 13, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

    Reflow profiles are dependent on numerous factors including package type number of components bo

  • OMAP35x Linux PSP Data Sheet
    PDF, 1.6 Mb, 档案已发布: Oct 16, 2009
  • Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
    PDF, 181 Kb, 修订版: B, 档案已发布: Mar 2, 2009
  • OMAP35x to AM35x Hardware Migration Guide
    PDF, 19 Kb, 档案已发布: May 24, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

    This article describes hardware device considerations to migrate a design

  • OMAP35x to AM37x Hardware Migration Guide
    PDF, 37 Kb, 档案已发布: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

    The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

  • PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
    PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
    PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

    PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
    PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
    PDF, 2.0 Mb, 档案已发布: Jun 23, 2010
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

  • Introduction to TMS320C6000 DSP Optimization
    PDF, 535 Kb, 档案已发布: Oct 6, 2011
    The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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制造商分类

  • Semiconductors > Processors > Digital Signal Processors > Media Processors > OMAP Processors