Datasheet RX74M (Renesas) - 10

RX74M Group 1. Overview
Table 1.1 Outline of Specifications (9/10) Classification Module/Function Description
SD/MMC host interface (SDHIc) 1 channel SD bus interface One interface for SD memory and I/O cards (supporting 1- and 4-bit SD buses) Compatible with the SD, SDHC, and SDXC formats MMC bus interface Data buses: Support for 1-, 4-, and 8-bit MMC buses Interrupt requests: Card access interrupt, SDIO access interrupt, card detection interrupt, interrupt of SD buffer access DMA transfer requests: SD_BUF write and SD_BUF read Support for card detection and write protection Arithmetic unit for trigonometric functions Calculation of sine, cosine, arctangent, and hypotenuse (TFUv2) Simultaneous calculation of sine and cosine Simultaneous calculation of arctangent and hypotenuse Delta-sigma modulator interface (DSMIFA) 6 channels Up to six external delta-sigma modulators are connectable. The sinc filters are selectable as first-, second-, or third-order. PWM synchronization triggered by a GPTW output. Parallel data capture unit (PDC) 1 channel Acquisition of synchronization through external 8-bit horizontal and vertical synchronization signals Setting of the image size when clipping of the output for a one-frame image is required Pulse-density modulation interface 1 channel (PDM-IF) Connectable with an external microphone 1-bit digital input data can be converted to 20- or 16-bit data. Four filters: Sinc filter, high-pass filter, correction filter, and half-band decimation filter Incorporates an internal buffer Phase-counting interface (PCIF) Two units Outputs ABZ-phase waveforms similar to incremental encoder outputs Carrier-cycle event input from the ELC 16-bit A/D converter (ADC16H) Three units Hybrid architecture that combines successive comparison and delta-sigma modulation Up to 16-bit resolution (switchable between 16, 14, 12, and 10 bits) High-speed conversion: 0.16 µs at the 50-MHz A/D conversion clock Self-calibration Extended analog functions: Self-diagnostic function, temperature sensor, internal reference voltage, VBATT voltage, D/A converter Channel-dedicated sample-and-hold function (3 channels only in unit 0) Supports single-ended and differential inputs 12-bit D/A converter (DAC12R) 2 channels 12-bit resolution Output voltage: 0.2 V to AVCC0 – 0.2 V (buffered output), 0 V to AVCC0 (unbuffered output) Buffered output or unbuffered output can be selected. Event linking by the ELC Temperature sensor 1 channel Relative precision: ± 1°C The voltage of the temperature is converted into a digital value by the 16-bit A/D converter. Detection of abnormally high and low temperatures Safety Memory-protection unit Protection area: Eight areas (max.) can be specified in the range from 0000 0000h to (MPU) FFFF FFFFh. Minimum protection unit: 32 bytes Reading from, writing to, and enabling the execution access can be specified for each area. An access exception occurs when the detected access is not in the permitted area. Register write protection Protects important registers from being overwritten for in case a program runs out of function control. R01DS0433EJ0110 Rev.1.10 Page 10 of 299 Jul 31, 2026 Document Outline Features 1. Overview 1.1 Outline of Specifications 1.2 List of Products 1.3 Block Diagram 1.4 Pin Functions 1.5 Pin Assignments 1.5.1 320-Pin LFBGA 1.5.2 224-Pin LFBGA 1.5.3 176-Pin LFBGA 1.5.4 176-Pin LFQFP 1.5.5 144-Pin LFQFP 1.5.6 100-Pin LFQFP 1.6 List of Pin and Pin Functions 1.6.1 320-Pin LFBGA 1.6.2 224-Pin LFBGA 1.6.3 176-Pin LFBGA 1.6.4 176-Pin LFQFP 1.6.5 144-Pin LFQFP 1.6.6 100-Pin LFQFP 2. Electrical Characteristics 2.1 Test Conditions 2.1.1 Maximum and Minimum Values (Max./Min.) 2.1.2 Typical Values (Typ.) 2.2 Absolute Maximum Ratings 2.3 Recommended Operating Conditions 2.4 DC Characteristics 2.4.1 Characteristics of the Input Voltage of the I/O Pins 2.4.2 Characteristics of the Output Voltage of the I/O Pins 2.4.3 Characteristics of the Other I/O Pins 2.4.4 Operating and Standby Currents 2.4.4.1 Operating and Standby Currents for Product Part No. R5K574Mxy4xx (y = A, B, C, D, T, U, V, W) 2.4.4.2 Operating and Standby Currents for Product Part No. R5K574Mxy4xx (y = E, F) 2.4.4.3 Currents in Deep Software Standby Mode 2.4.4.4 Other Operating Currents 2.4.4.5 Permissible Output Currents 2.4.5 Thermal Characteristics 2.4.5.1 Thermal Resistance Value 2.4.5.2 Supply Currents for the Peripheral Functions 2.4.5.3 Example of Calculation of Ta 2.4.6 VCC Rising and Falling Slopes and Ripple Frequency 2.5 AC Characteristics 2.5.1 Operating Frequency 2.5.2 Clock Timing 2.5.3 Reset Timing 2.5.4 Timing of Return from Low Power Consumption Modes 2.5.5 Control Signal Timing 2.5.6 Bus Timing 2.5.7 Timing of On-Chip Peripheral Modules 2.5.7.1 I/O Port 2.5.7.2 TMR 2.5.7.3 CMTW 2.5.7.4 POEG 2.5.7.5 GPTW 2.5.7.6 RSCI 2.5.7.7 RSPIA 2.5.7.8 XSPI 2.5.7.9 RIICHS 2.5.7.10 RI3C 2.5.7.11 SSIE 2.5.7.12 SD/MMC Host Interface 2.5.7.13 PDC 2.5.7.14 HRPWM 2.5.7.15 CANFD/CANFDG 2.5.7.16 ESC 2.5.7.17 ESWM 2.5.7.18 PDMIF 2.5.7.19 Δ-Σ Interface 2.5.7.20 PCIF 2.5.7.21 PIO 2.5.7.22 A/D Converter Trigger 2.5.7.23 CAC 2.6 USB Characteristics 2.6.1 USB Timing 2.6.2 USBHS Timing 2.7 A/D Conversion Characteristics 2.7.1 Analog Input Voltage Range 2.7.2 Common Characteristics of the 16-Bit A/D Converter 2.7.3 SAR Mode Characteristics 2.7.4 Common Characteristics of Oversampling Mode and Hybrid Mode 2.7.5 Oversampling Mode Characteristics 2.7.6 Hybrid Mode Characteristics 2.8 D/A Conversion Characteristics 2.9 Temperature Sensor Characteristics 2.10 Power-on Reset Circuit and Voltage Detection Circuit Characteristics 2.11 Core Voltage Monitoring Reset Characteristics 2.12 Oscillation Stop Detection Timing 2.13 External VDD Timing Characteristics 2.14 Battery Backup Function Characteristics 2.15 MRAM Characteristics 2.15.1 Code MRAM Characteristics 2.15.2 Option-Setting Memory (MRAM Area) Characteristics 2.15.3 Option-Setting Memory (OTP Area with ECC) Characteristics 2.15.4 Option-Setting Memory (OTP Area without ECC) Characteristics 2.15.5 MACI Command Characteristics 2.15.6 W-HUK Zeroization Characteristics 2.15.7 MRAM Magnetic Field Resistance Characteristics 2.15.8 Data MRAM Characteristics 2.16 Boundary Scan 2.17 Usage Note 2.17.1 Connecting VCL Capacitor and Bypass Capacitors Appendix 1. Package Dimensions REVISION HISTORY General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products Notice