Datasheet HCPL-2300 (Broadcom) - 5

制造商Broadcom
描述8 MBd Low Input Current Optocoupler
页数 / 页14 / 5 — Solder Reflow Temperature Profile. Regulatory Information. Recommended …
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文件语言英语

Solder Reflow Temperature Profile. Regulatory Information. Recommended Pb-Free IR Profile. CSA. IEC/EN/DIN EN 60747-5-5

Solder Reflow Temperature Profile Regulatory Information Recommended Pb-Free IR Profile CSA IEC/EN/DIN EN 60747-5-5

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Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-2300 has been approved by the following or- ganizations:
Recommended Pb-Free IR Profile UL
Recognized under UL 1577, Component Recognition Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-5
Maximum Working Insulation Voltage V = 630V IORM peak (Option 060 only) Note: Non-halide flux should be used.
Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions
Min. External Air Gap L(IO1) 7.1 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air Min. External Tracking Path L(IO2) 7.4 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body Min. Internal Plastic Gap 0.08 mm Through insulation distance, conductor to (Internal Clearance) conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity Tracking Resistance CTI 175 V DIN IEC 112/VDE 0303 PART 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – surface mount classification is Class A in accordance with CECC 00802. 5