Datasheet TP65B110HRU (Renesas) - 7
| 制造商 | Renesas |
| 描述 | 650V 110mΩ High-Voltage GaN Bidirectional Switch in TOLT Package |
| 页数 / 页 | 15 / 7 — TP65B110HRU Datasheet. 3. Typical Characteristics. Figure 2. Typical … |
| 文件格式/大小 | PDF / 1.6 Mb |
| 文件语言 | 英语 |
TP65B110HRU Datasheet. 3. Typical Characteristics. Figure 2. Typical Output Characteristics, TJ = 25°C
该数据表的模型线
文件文字版本
TP65B110HRU Datasheet 3. Typical Characteristics
TC = 25°C unless otherwise stated.
Figure 2. Typical Output Characteristics, TJ = 25°C Figure 3. Typical Output Characteristics, TJ = 150°C
Parameter: VG1S1 Parameter: VG1S1
Figure 4. Typical Transfer Characteristics, Figure 5. Typical Reverse Conduction Characteristics,
Parameter: TJ Parameter: TJ R07DS1683EU0100 Rev.1.00 Page 7 Mar 10, 2026 Document Outline 1. Pin Information 1.1 Pin Assignments 1.2 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Specifications 2.3 Recommended Operating Conditions 2.4 Gate Characteristics 2.5 On-State Characteristics 2.6 Off-State Characteristics 2.7 Dynamic Characteristics 2.8 Diode Characteristics 3. Typical Characteristics 4. Test Circuits and Waveforms 5. Modes of Operation 6. Device Architecture 7. Design Considerations 8. Package Outline Drawings 9. Related Information 10. Ordering Information 11. Revision History
TC = 25°C unless otherwise stated.
Figure 2. Typical Output Characteristics, TJ = 25°C Figure 3. Typical Output Characteristics, TJ = 150°C
Parameter: VG1S1 Parameter: VG1S1
Figure 4. Typical Transfer Characteristics, Figure 5. Typical Reverse Conduction Characteristics,
Parameter: TJ Parameter: TJ R07DS1683EU0100 Rev.1.00 Page 7 Mar 10, 2026 Document Outline 1. Pin Information 1.1 Pin Assignments 1.2 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Specifications 2.3 Recommended Operating Conditions 2.4 Gate Characteristics 2.5 On-State Characteristics 2.6 Off-State Characteristics 2.7 Dynamic Characteristics 2.8 Diode Characteristics 3. Typical Characteristics 4. Test Circuits and Waveforms 5. Modes of Operation 6. Device Architecture 7. Design Considerations 8. Package Outline Drawings 9. Related Information 10. Ordering Information 11. Revision History