Datasheet DB3, DB4, SMDB3 (STMicroelectronics) - 6
| 制造商 | STMicroelectronics |
| 描述 | DIAC |
| 页数 / 页 | 11 / 6 — DB3, DB4, SMDB3. Package information. 2.1. SOT23 package information. … |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
DB3, DB4, SMDB3. Package information. 2.1. SOT23 package information. Figure 7. SOT23-3L package outline. DS2125. Rev 3. page 6/11
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DB3, DB4, SMDB3 Package information 2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 SOT23 package information Figure 7. SOT23-3L package outline
B L 3 E H 1 2 e S c e1 D 0.25 Gauge plane A Seating plane a L1 A1 L
DS2125
-
Rev 3 page 6/11
Document Outline 1 Characteristics 1.1 Characteristics curves 2 Package information 2.1 SOT23 package information 2.2 DO-35 package information 3 Ordering information Revision history
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 SOT23 package information Figure 7. SOT23-3L package outline
B L 3 E H 1 2 e S c e1 D 0.25 Gauge plane A Seating plane a L1 A1 L
DS2125
-
Rev 3 page 6/11
Document Outline 1 Characteristics 1.1 Characteristics curves 2 Package information 2.1 SOT23 package information 2.2 DO-35 package information 3 Ordering information Revision history