Datasheet RA6W1 (Renesas)

制造商Renesas
描述Highly Integrated Ultra-Low Power Dual-Band Wi-Fi 6 Arm Cortex-M33 MCU
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RA6W1. Advanced security and encryption. Wi-Fi Alliance certifications. Features. Arm. Cortex. -M33 Core. Interfaces

Datasheet RA6W1 Renesas

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Datasheet
RA6W1
Arm-Cortex-M33-based Dual Band Wi-Fi 6 SoC The RA6W1 is a highly integrated ultra-low-power • Wi-Fi security: WPA/WPA2-Enterprise/Personal, Wi-Fi system on a chip (SoC) integrating an Arm® WPA2 SI, WPA3 SAE, and OWE Cortex®-M33 system processor with a dual band • Vendor EAP types: EAP-TTLS/MSCHAPv2, 802.11a/b/g/n/ax Wi-Fi subsystem, on-chip memory, PEAPv0/EAP-MSCHAPv2, PEAPv1, EAP-FAST, flexible peripheral interfaces, and power and EAP-TLS management features. This provides a standalone ▪
Advanced security and encryption
single chip solution which can support complex low- • Secure Crypto Engine power IoT solutions that require Wi-Fi network • Symmetric algorithms: AES, DES/3DES, CHACHA connectivity. • Hash/HMAC: SHA1/224/256 Extremely low-power operation is accomplished by • Asymmetric algorithms: RSA, DH, ECC dynamically disabling elements of the SoC which • TRNG are not in use, thus allowing a near zero level of • Secure boot power consumption when not actively transmitting • Secure debug (SWD) or receiving data. Such low-power operation can extend the battery life up to a year or more • Secure asset storage depending on the application. • Device lifecycle management • TLS/DTLS protocol acceleration Built from the ground up for the Internet of Things (IoT), the RA6W1 is ideal for door locks, ▪
Wi-Fi Alliance certifications
thermostats, sensors, pet trackers, asset trackers, • Wi-Fi CERTIFIED™ b, g, n sprinkler systems, connected lighting, video • WPA™ – Enterprise, Personal cameras, video doorbells, wearables, and other IoT • WPA2™ – Enterprise, Personal devices. • WPA3™ – Enterprise, Personal • Wi-Fi Enhanced Open™
Features
• WMM ▪
Arm
®
Cortex
®
-M33 Core
• WMM – Power Save • Armv8-M architecture • Wi-Fi Protected Setup™ • Maximum operating frequency: 160 MHz ▪
Interfaces
• Arm Memory Protection Unit (Arm MPU) • SPI Master/Slave interface o Protected Memory System Architecture • I2C Master/Slave interface (PMSAv8) • I2S for digital audio streaming o MPU: eight regions • PDM/Digital Mic for digital audio streaming • SysTick timer • General PWM Timer 32-bit × 8 ▪
Full Networking OS and TCP/IP stack
• Multiplexed GPIO × 28 • Comprehensive networking software stack • ADC (12-bit SAR) for sensor interfaces × 4 • Provide TCP/IP stack: in the form of network socket • eMMC/SD expanded memory APIs • SDIO Host/Slave function ▪
Wi-Fi processor
• OQSPI with encrypted XIP for external code/data • Operating modes: Station, Soft AP Flash • Bluetooth® coexistence • QSPI for additional PSRAM storage • WPS-PIN/PBC for easy Wi-Fi provisioning • UART × 3 • Connection manager for autonomous and fast Wi-Fi ▪
Power management unit
connections • On-Chip RTC • IEEE 802.11b/g/n/ax, 1×1, 20 MHz channel • Wake-up control of fast booting or full booting with bandwidth, 2.4 GHz minimal initialization time • IEEE 802.11a/n/ac/ax, 1×1, 20 MHz channel • Integrated DCDC and LDOs bandwidth, 5 GHz • Support for ultra-low-power Sleep modes • IEEE 802.11s Wi-Fi mesh • On-chip PA, LNA, and RF switch R19DS0136EK0100 Rev. 1.00 Page 1 Nov 26, 2025 CFR0011-120-00 © 2025 Renesas Electronics Document Outline Features Applications Contents Figures Tables 1. Terms and Definitions 2. Block Diagrams 3. Part Numbering 4. RA6W1 Product Group 5. Pin Information 5.1 FCQFN Pinout 5.2 WLCSP Pinout 5.3 Pin Descriptions 6. Specifications 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics 6.4 Crystal Oscillator 40 MHz – Recommended Operating Conditions 6.5 XTAL32K – Recommended Operating Conditions 6.6 GPADC – DC Characteristics 6.7 GPADC – Electrical Performance 6.8 RST_N Digital I/O – Recommended Operating Conditions 6.9 GPIO – Recommended Operating Conditions 6.10 GPIO – DC Characteristics 6.11 Radio 6.11.1 wlCSP Package WLAN Radio Characteristics 6.11.2 QFN Package WLAN Radio Characteristics 7. System Overview 8. Core System 8.1 Arm Cortex-M33 8.1.1 Introduction 8.1.2 Interrupts 8.1.3 Debug 8.2 Internal Memory Architecture 8.2.1 Introduction 8.2.2 ROM 8.2.3 System RAM 8.2.4 Retention RAM 8.2.5 OTP 8.2.6 System Address Map 8.3 Clock Generation 8.3.1 Introduction 8.3.2 System Clock (SYS_CLK, HCLK) 8.3.3 Peripheral Clocks (SPI_CLK, PERI_CLK, AUX_CLK) 8.3.4 Audio Clocks (AUD_CLK) 8.3.5 RTC Clocks (32 kHz) 8.4 Power Management 8.4.1 Power-On Sequence 8.4.2 Power Management Unit 8.5 Sleep Modes 8.5.1 Introduction 8.5.2 Wake-Up Sources 8.5.3 Sleep Mode Active Blocks Overview 8.6 DMA 8.6.1 Introduction 8.6.2 General Purpose DMA 8.6.2.1 Input/Output Multiplexer 8.6.2.2 DMA Channel Operation 8.6.2.3 DMA Arbitration 8.6.2.4 Freezing DMA Channels 8.6.3 Fast DMA 8.7 Hardware Accelerators 8.7.1 CRC Calculation 8.7.2 Pseudo Random Number Generation 8.8 Watchdog Timer 8.8.1 Introduction 8.9 Brownout and Blackout Detection 8.10 Security Features 8.10.1 Crypto Engine 8.11 Debug Support 9. Peripherals 9.1 UART 9.1.1 Introduction 9.1.2 RS-232 9.1.3 RS-485 9.1.4 Baud Rate 9.1.5 Hardware Flow Control 9.1.6 Interrupts 9.1.7 DMA Interface 9.1.8 Pin Configuration 9.2 I2C Interface 9.2.1 Introduction 9.2.2 I2C Behavior 9.2.2.1 START and STOP Generation 9.2.2.2 Combined Formats 9.2.3 I2C Protocols 9.2.3.1 START and STOP Conditions 9.2.3.2 Addressing Slave Protocol 9.2.3.2.1 7-bit Address Format 9.2.3.2.2 10-bit Address Format 9.2.3.3 Transmitting and Receiving Protocols 9.2.3.3.1 Master-Transmitter and Slave-Receiver 9.2.3.3.2 Master-Receiver and Slave-Transmitter 9.2.3.3.3 START Byte Transfer Protocol 9.2.4 Multiple Master Arbitration 9.2.5 Clock Synchronization 9.3 Digital Audio Interface (I2S and PDM) 9.3.1 Introduction 9.3.2 Interface Signals 9.3.3 Master and Slave Modes 9.3.4 DAI Slots 9.3.5 DAI Slot Formats 9.3.5.1 I2S Format 9.3.5.2 DSP Format 9.3.5.3 Left-Justified Format 9.3.5.4 Right-Justified Format 9.3.5.5 Time Division Multiplexing Mode 9.3.6 DAI Slot Assignment 9.3.7 DAI PCM_CLK Generation 9.4 SPI Master/Slave 9.4.1 Introduction 9.4.2 SPI Timing 9.5 SDIO 9.5.1 Introduction 9.6 SD/eMMC Host Controller 9.6.1 Introduction 9.7 Octa/Quad SPI Flash Controller – With Secure XIP 9.7.1 Introduction 9.7.1.1 Interface 9.7.1.2 SPI Modes 9.7.1.3 Access Modes 9.7.1.3.1 Auto Mode 9.7.1.3.2 Manual Mode 9.7.1.4 Endianness 9.7.1.5 Erase Suspend/Resume 9.7.1.6 On-the-fly Decryption 9.8 Quad SPI RAM/Flash Controller – PSRAM 9.8.1 Introduction 9.8.2 Interface 9.8.3 SPI Modes 9.8.4 Access Modes 9.8.4.1 Auto Mode Flash Access 9.8.4.2 Auto Mode RAM Access 9.8.4.3 Manual Mode 9.8.5 Endianness 9.8.6 Erase Suspend/Resume 9.8.7 Low Power Considerations 9.9 General Purpose Timers/PWMs 9.9.1 Introduction 9.9.2 Timer Modes of Operation 9.9.2.1 Free-Running Counter 9.9.2.2 PWM Generation 9.9.2.3 Event Capturing 9.9.2.4 One Shot 9.9.2.5 GPIO Pulse Counter 9.9.3 Pin Configuration 9.10 GPIOs and Programmable Pin Assignment 9.11 ADC/Analog or ADC (Aux 12-bit) 9.11.1 Introduction 9.11.2 Timing Diagram 9.11.3 DMA Transfer 9.11.4 Sensor Wake-up 9.11.5 ADC Pin Configuration 9.12 Bluetooth LE/Zigbee Coexistence 9.12.1 One External Radio Coexistence Interface 9.12.2 Two External Radios Coexistence Interface 9.13 Antenna Switching Diversity 9.13.1 Introduction 10. Application Information 10.1 Wi-Fi Application 10.1.1 Typical Wi-Fi Application – FCQFN 10.1.2 Typical Wi-Fi Application – WLCSP 10.1.3 Wi-Fi Application with FEM – FCQFN 10.1.4 Wi-Fi Application with FEM – WLCSP 10.2 Wi-Fi and Bluetooth Combo Application 10.2.1 Typical Wi-Fi and Bluetooth Combo Application – FCQFN 10.2.2 Typical Wi-Fi and Bluetooth Combo Application – WLCSP 10.2.3 Wi-Fi and Bluetooth Combo Application with FEM – FCQFN 10.2.4 Wi-Fi and Bluetooth Combo Application with FEM – WLCSP 11. Registers 11.1 APU Registers 11.2 CACHE Registers 11.3 CRG Registers 11.4 CRG APU Registers 11.5 CRG PREG Registers 11.6 DAI Registers 11.7 DCACHE Registers 11.8 DMA Registers 11.9 GPIO Registers 11.10 General Purpose System Status Registers 11.11 I2C Registers 11.12 KDMA Registers 11.13 MEMCTRL Registers 11.14 OQSPI Registers 11.15 QSPI Registers 11.16 Retention Memory Control Registers 11.17 RTC Registers 11.18 SD/EMMC Registers 11.19 SDIO Registers 11.20 SPI Registers 11.21 SPI2 Registers 11.22 Source FIFO Registers 11.23 Source Interface Registers 11.24 Watchdog Timer Control Registers 11.25 AHB DMA Registers 11.26 AHB Arbitration Registers 11.27 Timer6 Registers 11.28 Timer Control Registers 11.29 Timer2 Control Registers 11.30 Timer3 Control Registers 11.31 Timer4 Control Registers 11.32 Timer5 Control Registers 11.33 Timer7 Control Registers 11.34 Timer8 Control Registers 11.35 UART Registers 11.36 UART2 Registers 11.37 ID Registers 12. Package Information 12.1 Moisture Sensitivity Level (MSL) 12.2 WLCSP Handling 12.3 Soldering Information 12.4 Package Outline Drawings 13. Revision History Appendix A ECAD Design Information A.1 Part Number Indexing A.2 Symbol Pin Information A.2.1 66-QFN A.2.2 70-WLCSP A.3 Symbol Parameters A.4 Footprint Design Information A.4.1 66-QFN A.4.2 70-WLCSP