Datasheet PSMN9R0-30YL (Nexperia) - 4
| 制造商 | Nexperia |
| 描述 | N-channel 30 V 8 mΩ logic level MOSFET in LFPAK |
| 页数 / 页 | 14 / 4 — NXP Semiconductors. PSMN9R0-30YL. N-channel 30 V 8 mΩ logic level MOSFET … |
| 修订版 | 10201103 |
| 文件格式/大小 | PDF / 394 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. PSMN9R0-30YL. N-channel 30 V 8 mΩ logic level MOSFET in LFPAK. Thermal characteristics. Table 5. Symbol
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NXP Semiconductors PSMN9R0-30YL N-channel 30 V 8 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from see Figure 4 - 1.9 2.7 K/W junction to mounting base 003aac544 10 Zth(j-mb) (K/W) δ 1 = 0.5 0.2 0.1 0.05 t P p 10-1 δ = T 0.02 single shot tp t T 10-2 t 10-6 10-5 10-4 10-3 10-2 10-1 p (s) 1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
PSMN9R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 04 — 9 March 2011 4 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Package outline 8. Revision history 9. Legal information 9.1 Data sheet status 9.2 Definitions 9.3 Disclaimers 9.4 Trademarks 10. Contact information 11. Contents
NXP Semiconductors PSMN9R0-30YL N-channel 30 V 8 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from see Figure 4 - 1.9 2.7 K/W junction to mounting base 003aac544 10 Zth(j-mb) (K/W) δ 1 = 0.5 0.2 0.1 0.05 t P p 10-1 δ = T 0.02 single shot tp t T 10-2 t 10-6 10-5 10-4 10-3 10-2 10-1 p (s) 1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
PSMN9R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 04 — 9 March 2011 4 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Package outline 8. Revision history 9. Legal information 9.1 Data sheet status 9.2 Definitions 9.3 Disclaimers 9.4 Trademarks 10. Contact information 11. Contents