Datasheet MAX882, MAX883, MAX884 (Maxim) - 10
| 制造商 | Maxim |
| 描述 | 5V/3.3V or Adjustable, Low-Dropout, Low-IQ, 200mA Linear Regulator with Standby Mode |
| 页数 / 页 | 17 / 10 — 5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators. … |
| 文件格式/大小 | PDF / 514 Kb |
| 文件语言 | 英语 |
5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators. MAX882/MAX883/MAX884
该数据表的模型线
文件文字版本
5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators
1.6 250 MAX883, VOUT = 5V MAXIMUM POWER 1.5 8-PIN SO PACKAGE DISSIPATION LIMIT MAX882/4-fig04 MAX882/4-05a MAXIMUM CURRENT 77.4cm2, 200 SINGLE-SIDED BOARD 1.4 1oz COPPER HIGH- GLASS EPOXY, POWER 1.3 150 T SOIC J = +125°C, TA = +25°C, STILL AIR PLASTIC DIP 1.2 100 CERAMIC DIP 1.1 POWER DISSIPATION (W) OPERATING 50 MAXIMUM OUTPUT CURRENT (mA) 1.0 REGION AT TA = +25°C TYPICAL DROPOUT VOLTAGE LIMIT T MAXIMUM SUPPLY VOLTAGE LIMIT J = +125°C 0.9 0 0.1cm2 1cm2 10cm2 100cm2 2 3 4 5 6 7 8 9 10 11 12 13 0.0155in2 0.155in2 1.55in2 15.5in2 SUPPLY VOLTAGE (V) COPPER GROUND PAD AREA Figure 4. Typical Maximum Power Dissipation vs. Ground Pad Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum Area Output Current vs. Supply Voltage
MAX882/MAX883/MAX884
The GND pins of the MAX882/MAX883/MAX884 SOIC package perform the dual function of providing an elect- rical connection to ground and channeling heat away. Con- nect all GND pins to ground using a large pad or ground 250 plane. Where this is impossible, place a copper plane on an MAXIMUM POWER DISSIPATION LIMIT adjacent layer. For a given power dissipation, the pad MAXIMUM CURRENT MAX882/4-05b should exceed the associated dimensions in Figure 4. 200 HIGH- Figure 4 assumes the IC is in an 8-pin small-outline pack- POWER SOIC age that has a maximum junction temperature of +125°C 150 PLASTIC DIP and is soldered directly to the pad; it also has a +25°C ambient air temperature and no other heat sources. Use 100 larger pad sizes for other packages, lower junction tem- CERAMIC DIP peratures, higher ambient temperatures, or conditions OPERATING 50 where the IC is not soldered directly to the heat-sinking MAXIMUM OUTPUT CURRENT (mA) REGION AT TA = +25°C ground pad. When operating C- and E-grade parts up to a TYPICAL DROPOUT VOLTAGE LIMIT TJ = +125°C MAXIMUM SUPPLY VOLTAGE LIMIT TJ of +125°C, expect performance similar to M-grade 0 specifications. For T 4 5 6 7 8 9 10 11 12 13 J between +125°C and +150°C, the output voltage may drift more. SUPPLY VOLTAGE (V) The MAX882/MAX883/MAX884 can regulate currents up to 250mA and operate with input voltages up to 11.5V, but Figure 5b. Safe Operating Regions: MAX883 Maximum Output not simultaneously. High output currents can only be sus- Current vs. Supply Voltage tained when input-output differential voltages are small, as shown in Figure 5. Maximum power dissipation depends on packaging, temperature, and air flow. The maximum output current is as follows: P(T − T ) I J A OUT(MAX) = (V − V )100 C IN OUT ° where P is derived from Figure 4.
10 ______________________________________________________________________________________
1.6 250 MAX883, VOUT = 5V MAXIMUM POWER 1.5 8-PIN SO PACKAGE DISSIPATION LIMIT MAX882/4-fig04 MAX882/4-05a MAXIMUM CURRENT 77.4cm2, 200 SINGLE-SIDED BOARD 1.4 1oz COPPER HIGH- GLASS EPOXY, POWER 1.3 150 T SOIC J = +125°C, TA = +25°C, STILL AIR PLASTIC DIP 1.2 100 CERAMIC DIP 1.1 POWER DISSIPATION (W) OPERATING 50 MAXIMUM OUTPUT CURRENT (mA) 1.0 REGION AT TA = +25°C TYPICAL DROPOUT VOLTAGE LIMIT T MAXIMUM SUPPLY VOLTAGE LIMIT J = +125°C 0.9 0 0.1cm2 1cm2 10cm2 100cm2 2 3 4 5 6 7 8 9 10 11 12 13 0.0155in2 0.155in2 1.55in2 15.5in2 SUPPLY VOLTAGE (V) COPPER GROUND PAD AREA Figure 4. Typical Maximum Power Dissipation vs. Ground Pad Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum Area Output Current vs. Supply Voltage
MAX882/MAX883/MAX884
The GND pins of the MAX882/MAX883/MAX884 SOIC package perform the dual function of providing an elect- rical connection to ground and channeling heat away. Con- nect all GND pins to ground using a large pad or ground 250 plane. Where this is impossible, place a copper plane on an MAXIMUM POWER DISSIPATION LIMIT adjacent layer. For a given power dissipation, the pad MAXIMUM CURRENT MAX882/4-05b should exceed the associated dimensions in Figure 4. 200 HIGH- Figure 4 assumes the IC is in an 8-pin small-outline pack- POWER SOIC age that has a maximum junction temperature of +125°C 150 PLASTIC DIP and is soldered directly to the pad; it also has a +25°C ambient air temperature and no other heat sources. Use 100 larger pad sizes for other packages, lower junction tem- CERAMIC DIP peratures, higher ambient temperatures, or conditions OPERATING 50 where the IC is not soldered directly to the heat-sinking MAXIMUM OUTPUT CURRENT (mA) REGION AT TA = +25°C ground pad. When operating C- and E-grade parts up to a TYPICAL DROPOUT VOLTAGE LIMIT TJ = +125°C MAXIMUM SUPPLY VOLTAGE LIMIT TJ of +125°C, expect performance similar to M-grade 0 specifications. For T 4 5 6 7 8 9 10 11 12 13 J between +125°C and +150°C, the output voltage may drift more. SUPPLY VOLTAGE (V) The MAX882/MAX883/MAX884 can regulate currents up to 250mA and operate with input voltages up to 11.5V, but Figure 5b. Safe Operating Regions: MAX883 Maximum Output not simultaneously. High output currents can only be sus- Current vs. Supply Voltage tained when input-output differential voltages are small, as shown in Figure 5. Maximum power dissipation depends on packaging, temperature, and air flow. The maximum output current is as follows: P(T − T ) I J A OUT(MAX) = (V − V )100 C IN OUT ° where P is derived from Figure 4.
10 ______________________________________________________________________________________