Datasheet CPD73 (Central Semiconductor) - 3
| 制造商 | Central Semiconductor |
| 描述 | Bridge Rectifier Monolithic Quad Diode Bridge Chip |
| 页数 / 页 | 9 / 3 — BARE DIE PACKING OPTIONS. BARE DIE IN TRAY (WAFFLE) PACK CT. (example: … |
| 文件格式/大小 | PDF / 709 Kb |
| 文件语言 | 英语 |
BARE DIE PACKING OPTIONS. BARE DIE IN TRAY (WAFFLE) PACK CT. (example: CP211-PART NUMBER-CT). (example: CP211-PART NUMBER-CM)
该数据表的模型线
文件文字版本
BARE DIE PACKING OPTIONS BARE DIE IN TRAY (WAFFLE) PACK CT
: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT) CM
: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM) UNSAWN WAFER WN
: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR
: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
www.centra lsemi.com
: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT) CM
: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM) UNSAWN WAFER WN
: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR
: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
www.centra lsemi.com