Datasheet BSN254, BSN254A (NXP) - 7

制造商NXP
描述N-channel enhancement mode vertical D-MOS transistor
页数 / 页12 / 7 — PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 …
文件格式/大小PDF / 75 Kb
文件语言英语

PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 leads (on-circle). SOT54 variant

PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads (on-circle) SOT54 variant

文件文字版本

Philips Semiconductors Product specification N-channel enhancement mode BSN254; BSN254A vertical D-MOS transistor
PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads (on-circle) SOT54 variant
c L2 E d A L b
1 2
e1 D e
3
b1 L1 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) L (1) L UNIT 2 A b b c D d E e e L 1 1 1 max max
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5 mm 2.54 1.27 2.5 2.5 5.0 0.40 0.56 0.40 4.4 1.4 3.6 12.7
Notes
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT54 variant TO-92 variant SC-43 98-03-26 2002 Feb 19 7 Document Outline FEATURES APPLICATIONS DESCRIPTION QUICK REFERENCE DATA PINNING LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE SOT54 variant DATA SHEET STATUS DEFINITIONS DISCLAIMERS