Datasheet MC10EL16, MC100EL16 (ON Semiconductor) - 6
| 制造商 | ON Semiconductor |
| 描述 | 5.0 V ECL Differential Receiver |
| 页数 / 页 | 9 / 6 — PACKAGE DIMENSIONS. SOIC−8 NB. SCALE 1:1. −X−. −Y−. MILLIMETERS. INCHES. … |
| 修订版 | 10 |
| 文件格式/大小 | PDF / 258 Kb |
| 文件语言 | 英语 |
PACKAGE DIMENSIONS. SOIC−8 NB. SCALE 1:1. −X−. −Y−. MILLIMETERS. INCHES. DIM. MIN. MAX. N X 45. SEATING. PLANE. −Z−. GENERIC. MARKING DIAGRAM*
该数据表的模型线
文件文字版本
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−8 NB
8 CASE 751−07 1 ISSUE AK DATE 16 FEB 2011
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
8 8 8 8 XXXXX XXXXX XXXXXX XXXXXX ALYWX ALYWX AYWW 1.52 AYWW G G 0.060 1 1 1 1
IC IC Discrete Discrete (Pb−Free) (Pb−Free)
7.0 4.0 XXXXX = Specific Device Code XXXXXX = Specific Device Code 0.275 0.155 A = Assembly Location A = Assembly Location L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = Pb−Free Package G = Pb−Free Package 0.6 1.270 *This information is generic. Please refer to 0.024 0.050 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may SCALE 6:1 ǒ mm Ǔ inches not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42564B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−8 NB PAGE 1 OF 2
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SOIC−8 NB
8 CASE 751−07 1 ISSUE AK DATE 16 FEB 2011
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
8 8 8 8 XXXXX XXXXX XXXXXX XXXXXX ALYWX ALYWX AYWW 1.52 AYWW G G 0.060 1 1 1 1
IC IC Discrete Discrete (Pb−Free) (Pb−Free)
7.0 4.0 XXXXX = Specific Device Code XXXXXX = Specific Device Code 0.275 0.155 A = Assembly Location A = Assembly Location L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = Pb−Free Package G = Pb−Free Package 0.6 1.270 *This information is generic. Please refer to 0.024 0.050 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may SCALE 6:1 ǒ mm Ǔ inches not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42564B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−8 NB PAGE 1 OF 2
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com