Datasheet HSMS-280x (Avago Technologies) - 6
| 制造商 | Avago Technologies |
| 描述 | Surface Mount RF Schottky Barrier Diodes |
| 页数 / 页 | 10 / 6 — SMT Assembly. Critical Zone T to Tp. Ramp-up. T L. max. ture. Ts min. … |
| 文件格式/大小 | PDF / 165 Kb |
| 文件语言 | 英语 |
SMT Assembly. Critical Zone T to Tp. Ramp-up. T L. max. ture. Ts min. Tempera. Ramp-down. Preheat. t 25. C to Peak. Time
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SMT Assembly
Reliable assembly of surface mount components is a zones. The preheat zones increase the temperature of the complex process that involves many material, process, and board and components to prevent thermal shock and equipment factors, including: method of heating (e.g., IR begin evaporating solvents from the solder paste. The or vapor phase reflow, wave soldering, etc.) circuit board reflow zone briefly elevates the temperature sufficiently material, conductor thickness and pattern, type of solder to produce a reflow of the solder. alloy, and the thermal conductivity and thermal mass of The rates of change of temperature for the ramp-up and components. Components with a low mass, such as the cool-down zones are chosen to be low enough to not SOT package, will reach solder reflow temperatures faster cause deformation of the board or damage to compo- than those with a greater mass. nents due to thermal shock. The maximum temperature Avago’s SOT diodes have been qualified to the time- in the reflow zone (TMAX) should not exceed 260°C. temperature profile shown in Figure 8. This profile is These parameters are typical for a surface mount assem- representative of an IR reflow type of surface mount as- bly process for Avago diodes. As a general guideline, the sembly process. circuit board and components should be exposed only After ramping up from room temperature, the circuit to the minimum temperatures and times necessary to board with components attached to it (held in place achieve a uniform reflow of solder. with solder paste) passes through one or more preheat
tp Tp Critical Zone T to Tp L Ramp-up T L Ts t max L ture Ts min Tempera ts Ramp-down Preheat 25 t 25
°
C to Peak Time Figure 8. Surface Mount Assembly Profile. Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max Preheat Temperature Min (TS(min)) 150°C Temperature Max (TS(max)) 200°C Time (min to max) (tS) 60-180 seconds Ts(max) to TL Ramp-up Rate 3°C/second max Time maintained above: Temperature (TL) 217°C Time (tL) 60-150 seconds Peak Temperature (TP) 260 +0/-5°C Time within 5 °C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6°C/second max Time 25 °C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface 6
Reliable assembly of surface mount components is a zones. The preheat zones increase the temperature of the complex process that involves many material, process, and board and components to prevent thermal shock and equipment factors, including: method of heating (e.g., IR begin evaporating solvents from the solder paste. The or vapor phase reflow, wave soldering, etc.) circuit board reflow zone briefly elevates the temperature sufficiently material, conductor thickness and pattern, type of solder to produce a reflow of the solder. alloy, and the thermal conductivity and thermal mass of The rates of change of temperature for the ramp-up and components. Components with a low mass, such as the cool-down zones are chosen to be low enough to not SOT package, will reach solder reflow temperatures faster cause deformation of the board or damage to compo- than those with a greater mass. nents due to thermal shock. The maximum temperature Avago’s SOT diodes have been qualified to the time- in the reflow zone (TMAX) should not exceed 260°C. temperature profile shown in Figure 8. This profile is These parameters are typical for a surface mount assem- representative of an IR reflow type of surface mount as- bly process for Avago diodes. As a general guideline, the sembly process. circuit board and components should be exposed only After ramping up from room temperature, the circuit to the minimum temperatures and times necessary to board with components attached to it (held in place achieve a uniform reflow of solder. with solder paste) passes through one or more preheat
tp Tp Critical Zone T to Tp L Ramp-up T L Ts t max L ture Ts min Tempera ts Ramp-down Preheat 25 t 25
°
C to Peak Time Figure 8. Surface Mount Assembly Profile. Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max Preheat Temperature Min (TS(min)) 150°C Temperature Max (TS(max)) 200°C Time (min to max) (tS) 60-180 seconds Ts(max) to TL Ramp-up Rate 3°C/second max Time maintained above: Temperature (TL) 217°C Time (tL) 60-150 seconds Peak Temperature (TP) 260 +0/-5°C Time within 5 °C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6°C/second max Time 25 °C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface 6