Datasheet HSMS-280x (Avago Technologies) - 5
| 制造商 | Avago Technologies |
| 描述 | Surface Mount RF Schottky Barrier Diodes |
| 页数 / 页 | 10 / 5 — Applications Information Introduction —. 0.026. Product Selection. 0.079. … |
| 文件格式/大小 | PDF / 165 Kb |
| 文件语言 | 英语 |
Applications Information Introduction —. 0.026. Product Selection. 0.079. 0.039. 0.022. Dimensions in inches
该数据表的模型线
文件文字版本
Applications Information Introduction — 0.026 Product Selection
Avago’s family of Schottky products provides unique solutions to many design problems.
0.079
The first step in choosing the right product is to select the
0.039
diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the
0.022
HSMS-281x and HSMS-282x families. Each family has a dif- ferent set of characteristics which can be compared most
Dimensions in inches
easily by consulting the SPICE parameters in Table 1.
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
A review of these data shows that the HSMS-280x family
Products.
has the highest breakdown voltage, but at the expense of
Assembly Instructions
a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a
SOT-363 PCB Footprint
lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS-281x A recommended PCB pad layout for the miniature SOT- family is a hybrid Schottky (as is the HSMS-280x), offering 363 (SC-70, 6 lead) package is shown in Figure 7 (dimen- lower 1/f or flicker noise than the HSMS-282x family. sions are in inches). This layout provides ample allowance for package placement by automated assembly equip- In general, the HSMS-282x family should be the designer’s ment without adding parasitics that could impair the first choice, with the -280x family reserved for high voltage performance. applications and the HSMS-281x family for low flicker noise applications.
0.026 Assembly Instructions SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
0.079
323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for
0.039
package placement by automated assembly equipment without adding parasitics that could impair the perfor- mance.
0.018 Dimensions in inches Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. Table 1. Typical SPICE Parameters Parameter Units HSMS-280x HSMS-281x HSMS-282x
BV V 75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 N 1.08 1.08 1.08 RS Ω 30 10 6 PB (VJ) V 0.65 0.65 0.65 PT (XTI) 2 2 2 M 0.5 0.5 0.5 5
Avago’s family of Schottky products provides unique solutions to many design problems.
0.079
The first step in choosing the right product is to select the
0.039
diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the
0.022
HSMS-281x and HSMS-282x families. Each family has a dif- ferent set of characteristics which can be compared most
Dimensions in inches
easily by consulting the SPICE parameters in Table 1.
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
A review of these data shows that the HSMS-280x family
Products.
has the highest breakdown voltage, but at the expense of
Assembly Instructions
a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a
SOT-363 PCB Footprint
lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS-281x A recommended PCB pad layout for the miniature SOT- family is a hybrid Schottky (as is the HSMS-280x), offering 363 (SC-70, 6 lead) package is shown in Figure 7 (dimen- lower 1/f or flicker noise than the HSMS-282x family. sions are in inches). This layout provides ample allowance for package placement by automated assembly equip- In general, the HSMS-282x family should be the designer’s ment without adding parasitics that could impair the first choice, with the -280x family reserved for high voltage performance. applications and the HSMS-281x family for low flicker noise applications.
0.026 Assembly Instructions SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
0.079
323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for
0.039
package placement by automated assembly equipment without adding parasitics that could impair the perfor- mance.
0.018 Dimensions in inches Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. Table 1. Typical SPICE Parameters Parameter Units HSMS-280x HSMS-281x HSMS-282x
BV V 75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 N 1.08 1.08 1.08 RS Ω 30 10 6 PB (VJ) V 0.65 0.65 0.65 PT (XTI) 2 2 2 M 0.5 0.5 0.5 5