Datasheet PESD4V0Z2BCDF (Nexperia) - 4

制造商Nexperia
描述Extremely low clamping low capacitance ESD protection
页数 / 页12 / 4 — Nexperia. PESD4V0Z2BCDF. Extremely low clamping low capacitance ESD …
修订版17082020
文件格式/大小PDF / 292 Kb
文件语言英语

Nexperia. PESD4V0Z2BCDF. Extremely low clamping low capacitance ESD protection. 9. Characteristics Table 6. Characteristics

Nexperia PESD4V0Z2BCDF Extremely low clamping low capacitance ESD protection 9 Characteristics Table 6 Characteristics

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Nexperia PESD4V0Z2BCDF Extremely low clamping low capacitance ESD protection 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit
VBR breakdown voltage IR = 1 mA; Tamb = 25 °C - 7.4 - V IRM reverse leakage current VRWM = 5 V; Tamb = 25 °C - 1 30 nA Cd diode capacitance f = 1 MHz; VR = 0 V; Tamb = 25 °C - 0.31 0.37 pF f = 1 MHz; VR = 1.5 V; Tamb = 25 °C - 0.28 - pF VCL clamping voltage IPPM = 11 A; 8/20 µs; Tamb = 25 °C [1] - 5.8 - V IPP = 8 A; TLP; tp = 100 ns [2] - 4.4 - V IPP = 16 A; TLP; tp = 100 ns; [2] - 5.7 - V Tamb = 25 °C Rdyn dynamic resistance IR = 10 A; Tamb = 25 °C [2] - 0.19 - Ω IR = -10 A; Tamb = 25 °C [2] - 0.19 - Ω f-3dB -3 dB cut-off frequency Tamb = 25 °C; normalized to attenuation - > 9 - GHz at 1 MHz [1] Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5. [2] Non-repetitive current pulse, Transmission Line Pulse (TLP); square pulse; ANSI / ESD STM5.5.1-2008. aaa-031915 1 aaa-031916 0.4 Cd Sdd21 (pF) (dB) 0.3 -1 0.2 -3 0.1 -5 0 108 1011 1010 109 -4 -2 0 2 4 f (Hz) VI (V)
Fig. 3. Insertion loss; typical values Fig. 4. Capacitance as a function of input voltage; typical values
PESD4V0Z2BCDF All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 17 August 2020 4 / 12
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Characteristics 10. Application information 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents