Datasheet DA14531 (Dialog Semiconductor)

制造商Dialog Semiconductor
描述Ultra Low Power Bluetooth 5.1 SoC
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DA14531. Ultra Low Power Bluetooth 5.1 SoC. Final. General Description. Key Features. Datasheet. Revision 3.1. 09-Jul-2020

Datasheet DA14531 Dialog Semiconductor

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DA14531 Ultra Low Power Bluetooth 5.1 SoC Final General Description
The DA14531 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an Arm® Cortex-M0+ microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. It can be used as a standalone application processor or as a data pump in hosted systems. The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack is fully compliant with the Bluetooth® Low Energy 5.1 standard. The DA14531 has dedicated hardware for the Link Layer implementation of BLE and interface controllers for enhanced connectivity capabilities. The BLE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth® SIG as wel as custom profiles are supported. The device is suitable for disposables, wireless sensor nodes, beacons, proximity tags and trackers, smart HID devices (stylus, keyboards, mice, and trackpads), toys, and medical and industrial applications.
Key Features
■ Compatible with Bluetooth v5.1, ETSI EN 300 ■ Clocks 328 and EN 300 440 Class 2 (Europe), FCC □ 32 MHz crystal and 32 MHz RC osc. CFR47 Part 15 (US) and ARIB STD-T66 □ (Japan) 32 kHz crystal and 32/512 kHz RC osc. ■ □ Supports up to three BLE connections 15 kHz RCX as crystal replacement ■ ■ Typical cold boot to radio active 35 ms Programmable Reset Circuitry ■ ■ Processing power 2× General purpose Timers with capture and PWM capabilities □ 16 MHz 32-bit Arm® Cortex-M0+ with ■ SWD interface Digital interfaces □ □ 18300 EEMBC IoTMark-BLE® GPIOs: 6 (WLCSP17), 12 (FCGQFN24) score □ □ Dedicated Link Layer and AES-128 2× UARTs (one with flow control) Encryption Processor □ SPI Master/Slave up to 32 MHz (Master) □ Software-based True Random Number □ I2C bus at 100 kHz and 400 kHz Generator (TRNG) □ 3-axis capable Quadrature Decoder ■ Memories □ Keyboard controller □ 32 kB One-Time-Programmable (OTP) ■ Analog interfaces □ 48 kB Retainable System RAM □ 4-channel 10-bit ADC □ 144 kB ROM ■ Radio transceiver ■ Power management □ Fully integrated 2.4 GHz CMOS □ Integrated Buck/Boost DCDC converter transceiver □ Buck: 1.1 V ≤ VBAT_HIGH ≤ 3.3 V (min 1.8V if □ Single wire antenna OTP read needed) □ TX: 3.5 mA, RX: 2.2 mA (system currents □ Boost: 1.1 V ≤ VBAT_LOW ≤ 1.65 V with DC-DC, VBAT_HIGH =3 V and 0 dBm) □ Clock-less hibernation mode: Buck 270 □ Programmable transmit output power from nA, Boost 240 nA -19.5 dBm to +2.5 dBm □ Built-in temperature sensor for die □ -94 dBm receiver sensitivity temperature monitoring ■ Packages: □ WLCSP 17 balls, 1.7 × 2.05, 0.5 mm pitch □ FCGQFN 24 pins, 2.2 × 3, 0.4 mm pitch
Datasheet Revision 3.1 09-Jul-2020
CFR0011-120-00 1 of 374 © 2020 Dialog Semiconductor

Document Outline General Description Key Features Applications Key Benefits System Diagram Contents Figures Tables 1 Block Diagram 2 Packages and Pinout 2.1 WLCSP17 2.2 FCGQFN24 3 Specifications 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 DC Characteristics 3.4 Timing Characteristics 3.5 RCX Oscillator 3.6 XTAL32MHz Oscillator 3.7 XTAL32kHz Oscillator 3.8 RC32MHz Oscillator 3.9 DC-DC Converter 3.10 LDO_LOW Characteristics 3.11 Digital I/O Characteristics 3.12 Power On Reset 3.13 GP ADC 3.14 Temperature Sensor 3.15 Radio 4 System Overview 4.1 Internal Blocks 4.2 Power Management Unit 4.2.1 Introduction 4.2.2 Architecture 4.2.2.1 Digital Power Domains 4.2.2.2 Power Modes 4.2.2.3 VDD Level in Hibernation 4.2.2.4 Retainable Registers 4.2.3 Programming 4.2.3.1 Buck Configuration 4.2.3.2 Boost Configuration 4.2.3.3 Bypass Configuration 4.3 HW FSM (Power-up, Wake-up, and Go-to-Sleep) 4.3.1 Power-up/Wake-up in Buck Configuration 4.3.2 Power-up/Wake-up in Boost Configuration 4.3.3 Go-to-Sleep and Refresh Bandgap 4.4 OTP Memory Layout 4.4.1 OTP Header 4.4.2 Configuration Script 4.5 BootROM Sequence 5 Reset 5.1 Introduction 5.2 Architecture 5.2.1 POR, HW, and SW Reset 5.2.2 POR Functionality 5.2.2.1 POR Timer Clock 5.2.2.2 RST Pad 5.2.2.3 POR from GPIO 5.2.3 POR Timing Diagram 5.2.4 POR Considerations 5.3 Programming 6 Arm Cortex-M0+ 6.1 Introduction 6.2 Architecture 6.2.1 Interrupts 6.2.2 System Timer (systick) 6.2.3 Wake-Up Interrupt Controller 6.3 Programming 7 AMBA Bus 7.1 Introduction 7.2 Architecture 7.3 Programming 8 Memory Map 9 Memory Controller 9.1 Introduction 9.2 Architecture 9.2.1 Arbitration 10 Clock Generation 10.1 Clock Tree 10.1.1 General Clock Constraints 10.2 Crystal Oscillators 10.2.1 Frequency Control (32 MHz Crystal) 10.2.2 Automated Trimming and Settling Notification 10.3 RC Oscillators 10.3.1 Frequency Calibration 11 OTP Controller 11.1 Introduction 11.2 Architecture 11.2.1 OTP Accessing Considerations 11.3 Programming 12 DMA Controller 12.1 Introduction 12.2 Architecture 12.2.1 DMA Peripherals 12.2.2 Input/Output Multiplexer 12.2.3 DMA Channel Operation 12.2.4 DMA Arbitration 12.2.5 Freezing DMA Channels 12.3 Programming 12.3.1 Memory to Memory Transfers 12.3.2 Peripheral to Memory Transfers 13 I2C Interface 13.1 Introduction 13.2 Architecture 13.2.1 I2C Bus Terms 13.2.1.1 Bus Transfer Terms 13.2.2 I2C Behavior 13.2.2.1 START and STOP Generation 13.2.2.2 Combined Formats 13.2.3 I2C Protocols 13.2.3.1 START and STOP Conditions 13.2.3.2 Addressing Slave Protocol 7-bit Address Format 10-bit Address Format 13.2.3.3 Transmitting and Receiving Protocols Master-Transmitter and Slave-Receiver Master-Receiver and Slave-Transmitter START BYTE Transfer Protocol 13.2.4 Multiple Master Arbitration 13.2.5 Clock Synchronization 13.3 Programming 14 UART 14.1 Introduction 14.2 Architecture 14.2.1 UART (RS232) Serial Protocol 14.2.2 Clock Support 14.2.3 Interrupts 14.2.4 Programmable THRE Interrupt 14.2.5 Shadow Registers 14.2.6 Direct Test Mode 14.3 Programming 15 SPI Interface 15.1 Introduction 15.2 Architecture 15.2.1 SPI Timing 15.3 Programming 15.3.1 Master Mode 15.3.2 Slave Mode 16 Quadrature Decoder 16.1 Introduction 16.2 Architecture 16.3 Programming 17 Clockless Wakeup Controller 17.1 Introduction 17.2 Architecture 17.3 Programming 18 Clocked Wakeup Controller 18.1 Introduction 18.2 Architecture 18.3 Programming 19 Timer 0 19.1 Introduction 19.2 Architecture 19.3 Programming 19.3.1 Timer Functionality 19.3.2 PWM Generation 20 Timer 1 20.1 Introduction 20.2 Architecture 20.3 Programming 20.3.1 Timer Functionality 20.3.2 Capture Functionality 20.3.3 Frequency Measuring Functionality 21 Timer 2 21.1 Introduction 21.2 Architecture 21.3 Programming 21.3.1 PWM Generation 21.3.2 Freeze Functionality 22 Watchdog Timer 22.1 Introduction 22.2 Architecture 22.3 Programming 23 Temperature Sensor 23.1 Introduction 23.2 Architecture 23.2.1 Programming 23.2.1.1 Absolute Temperature 23.2.1.2 Relative Temperature 24 Keyboard Controller 24.1 Introduction 24.2 Architecture 24.2.1 Keyboard Scanner 24.2.2 GPIO Interrupt Generator 24.3 Programming 24.3.1 Keyboard Scanner 24.3.2 GPIO Interrupts 25 Input/Output Ports 25.1 Introduction 25.2 Architecture 25.2.1 Programmable Pin Assignment 25.2.1.1 Priority 25.2.1.2 Direction Control 25.2.2 General Purpose Port Registers 25.2.2.1 Port Data Register 25.2.2.2 Port Set Data Output Register 25.2.2.3 Port Reset Data Output Register 25.2.3 Fixed Assignment Functionality 25.2.4 Types of GPIO Pads 25.2.5 Driving Strength 26 General Purpose ADC 26.1 Introduction 26.2 Architecture 26.2.1 Input Channels 26.2.2 Operating Modes 26.2.2.1 Enabling the ADC 26.2.2.2 Manual Mode 26.2.2.3 Continuous Mode 26.2.3 Conversion Modes 26.2.3.1 AD Conversion Sampling Phase Conversion and Storage Phase 26.2.3.2 Averaging 26.2.3.3 Chopper Mode 26.2.4 Additional Settings 26.2.5 Non-Ideal Effects 26.2.6 Offset Calibration 26.2.7 Zero-Scale Adjustment 26.2.8 Common Mode Adjustment 26.2.9 Input Impedance, Inductance, and Input Settling 26.3 Programming 27 Real Time Clock (RTC) 27.1 Introduction 27.2 Architecture 27.3 Programming 28 Power 28.1 DCDC Converter 28.2 LDOs 28.3 POR Circuit 29 BLE Core 29.1 Architecture 29.1.1 Exchange Memory 29.2 Programming 29.2.1 Wake-Up IRQ 29.2.2 Switch from BLE Active Mode to BLE Deep Sleep Mode 29.2.3 Switch from BLE Deep Sleep Mode to BLE Active Mode 29.2.3.1 Switching at an Anchor Point 29.2.3.2 Switching Due to an External Event 30 Radio 30.1 Introduction 30.2 Architecture 30.2.1 Receiver 30.2.2 Synthesizer 30.2.3 Transmitter 30.2.4 RFIO 30.2.5 Biasing 30.2.6 RF Monitoring 31 Registers 31.1 Analog Miscellaneous Registers 31.2 BLE Core Registers 31.3 Clock Generation and Reset Registers 31.4 DCDC Converter Registers 31.5 DMA Controller Registers 31.6 General Purpose ADC Registers 31.7 General Purpose I/O Registers 31.8 General Purpose Registers 31.9 I2C Interface Registers 31.10 Keyboard Registers 31.11 Miscellaneous Registers 31.12 OTP Controller Registers 31.13 Quadrature Decoder Registers 31.14 Real Time Clock Registers 31.15 SPI Interface Registers 31.16 Timer and Triple PWM Registers 31.17 Timer1 Registers 31.18 UART Interface Registers 31.19 Chip Version Registers 31.20 Wake-Up Registers 31.21 Watchdog Registers 32 Ordering Information 33 Package Information 33.1 Moisture Sensitivity Level (MSL) 33.2 WLCSP Handling 33.3 Soldering Information 33.4 Package Outlines Revision History