Datasheet BM62, BM64 (Microchip) - 67

BM62/64
The BM64C2 Stereo Audio module is labeled with its For the BM64C2 Stereo Audio module, due to limited own KC mark. The final product requires the KC mark module size, the NCC Mark and ID is displayed in the and certificate number of the module: data sheet and/or packaging and cannot be displayed on the module label. A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): The user's manual must contain below warning (for RF http://www.kcc.go.kr device) in traditional Chinese: National Radio Research Agency (RRA): 注意 ! http://rra.go.kr 依據 低功率電波輻射性電機管理 ? 法
A.6 Taiwan
第十二條 經型式認證合格之低功率射頻電機，非經許 可， The BM62/BM64C1/BM64C2 Stereo Audio module 公司、商號或使用者均不得擅自變更頻率、加大功率或 has received compliance approval in accordance with 變更原設計 the Telecommunications Act. Customers seeking to use the compliance approval in their product must con- 之特性及功能。 tact Microchip Technology sales or distribution partners 第十四條 低功率射頻電機之使用不得影響飛航安全及 to obtain a Letter of Authority. 干擾合法通信； Integration of this module into a final product does not 經發現有干擾現象時，應立即停用，並改善至無干擾時 require additional radio certification provided installa- 方得繼續使用。 tion instructions are followed and no modifications of the module are allowed. 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用 A.6.1 LABELING AND USER 電波輻射性 INFORMATION REQUIREMENTS 電機設備之干擾。 For the BM62 Stereo Audio module, due to limited module size, the NCC mark and ID are displayed in the A.6.2 HELPFUL WEB SITES data sheet and/or packaging and cannot be displayed National Communications Commission (NCC): on the module label. http://www.ncc.gov.tw
A.7 China
The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. For the BM64C1 Stereo Audio module, due to limited Integration of this module into a final product does not module size, the NCC Mark and ID are displayed in the require additional radio certification, provided installa- data sheet and/or packaging and cannot be displayed tion instructions are followed and no modifications of on the module label. the module are allowed. A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 Stereo Audio module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID 2016DJ2656”.  2017-2020 Microchip Technology Inc.
Advanced
DS60001403F-Page 12 Document Outline Features DSP Audio Processing FIGURE 1: BM62 MODULE FIGURE 2: BM64 MODULE Audio Codec Peripherals RF/Analog HCI Interface MAC/Baseband Processor Operating Condition Compliance Applications Description Table of Contents Most Current Data Sheet Errata Customer Notification System 1.0 Device Overview FIGURE 1-1: SINGLE SPEAKER Application using BM62 Module FIGURE 1-2: SINGLE SPEAKER Application Using BM64 Module FIGURE 1-3: Multi-speaker application USING BM64 Module TABLE 1-1: BM62/64 KEY FEATURES FIGURE 1-4: BM62 Module PIN Diagram TABLE 1-2: BM62 Module PIN Description (Continued) FIGURE 1-5: bm64 Module pin diagram TABLE 1-3: BM64 Module PIN Description (Continued) 2.0 Audio 2.1 Digital Signal Processor FIGURE 2-1: Speech Signal Processing FIGURE 2-2: Audio Signal Processing 2.2 Codec FIGURE 2-3: CODEC DAC Dynamic Range FIGURE 2-4: CODEC DAC THD+N Versus input power FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC Frequency response (Single-EndED mode) 2.3 Auxiliary Port 2.4 Analog Speaker Output FIGURE 2-7: Analog speaker output Capless MODE FIGURE 2-8: Analog speaker output SINGLE-ENDed MODE 3.0 Transceiver 3.1 Transmitter 3.2 Receiver 3.3 Synthesizer 3.4 Modem 3.5 Adaptive Frequency Hopping (AFH) 4.0 Power Management Unit 4.1 Charging a Battery FIGURE 4-1: BATTERY CHARGING CURVE 4.2 Voltage Monitoring 4.3 LED Drivers FIGURE 4-2: LED Drivers 4.4 Under Voltage Protection (Software Dependent UVP) 4.5 Ambient Detection FIGURE 4-3: Ambient Detection 5.0 Application Information 5.1 Power Supply FIGURE 5-1: Power Tree DIAGRAM 5.2 Host MCU Interface FIGURE 5-2: HOST MCU INTERFACE OVER UART FIGURE 5-3: Power-On/Off Sequence FIGURE 5-4: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON State FIGURE 5-5: TIMING SEQUENCE OF POWER-OFF State FIGURE 5-6: TIMING SEQUENCE OF POWER-ON (NACK) FIGURE 5-7: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU FIGURE 5-8: TIMING SEQUENCE OF POWER DROP PROTECTION 5.2.1 Device FW Upgrade (DFU) FIGURE 5-9: Timing Diagram of Application Mode to DFU Mode FIGURE 5-10: Timing Diagram of DFU Mode to Application Mode 5.3 I2S Mode Application FIGURE 5-11: BM64 MODULE IN I2S MASTER MODE FIGURE 5-12: BM64 MODULE IN I2S SLAVE MODE 5.4 Reset 5.5 External Configuration and Programming FIGURE 5-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS TABLE 5-1: SYSTEM CONFIGURATION I/O PIN SETTINGS 5.6 Reference Circuit FIGURE 5-14: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-15: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-16: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-17: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-19: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-20: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-21: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION 6.0 Printed Antenna Information 6.1 Antenna Radiation Pattern FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN at 2441 MHz TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS 6.2 Module Placement Guidelines FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 7.0 Physical Dimensions FIGURE 7-1: BM62 Module PCB DIMENSION FIGURE 7-2: BM64 Module PCB DIMENSION FIGURE 7-3: RECOMMENDED BM62 Module PCB FOOTPRINT FIGURE 7-4: RECOMMENDED BM64 Module PCB FOOTPRINT 8.0 Electrical Characteristics TABLE 8-1: RECOMMENDED OPERATING CONDITION TABLE 8-2: I/O AND RESET LEVEL TABLE 8-3: BATTERY CHARGER TABLE 8-4: LED DRIVER TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION TABLE 8-10: BM64SPKS1MC2 EMBEDDED MODE (WITHOUT EXTERNAL MCU) SYSTEM CURRENT CONSUMPTION TABLE 8-11: BM64SPKS1MC2 HOST MCU MODE SYSTEM CURRENT CONSUMPTION 8.1 Timing specifications FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) FIGURE 8-3: AUDIO INTERFACE TIMING Diagram TABLE 8-12: AUDIO INTERFACE TIMING Specifications 9.0 Soldering Recommendations FIGURE 9-1: REFLOW PROFILE 10.0 Ordering Information TABLE 10-1: BM62/64 Module ORDERING INFORMATION Appendix A: Certification Notices TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2) TABLE A-2: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1) TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2) Appendix B: Revision History Revision A (May 2016) Revision B (December 2016) TABLE B-1: major Section Updates Revision C (October 2017) TABLE C-1: major Section Updates Revision D (March 2018) TABLE D-1: major Section Updates Revision E (September 2018) TABLE E-1: major Section Updates Revision F (June 2020) TABLE F-1: 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