Datasheet BM62, BM64 (Microchip) - 2

制造商Microchip
描述Bluetooth Stereo Audio Module
页数 / 页74 / 2 — BM62/64. Peripherals. Description. RF/Analog. HCI Interface. MAC/Baseband …
文件格式/大小PDF / 7.0 Mb
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BM62/64. Peripherals. Description. RF/Analog. HCI Interface. MAC/Baseband Processor. Operating Condition. Compliance. Applications

BM62/64 Peripherals Description RF/Analog HCI Interface MAC/Baseband Processor Operating Condition Compliance Applications

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BM62/64 Peripherals Description
• Built-in lithium-ion and lithium-polymer battery The BM62/64 Stereo Audio module is a fully qualified charger (up to 350 mA) Bluetooth v5.0 dual-mode (BDR/EDR/BLE) module for • Integrated 1.8V and 3V configurable switching designers to add wireless audio and voice applications regulator and Low-Dropout (LDO) regulator to their products. The BM62/64 module is a Bluetooth • Built-in ADC for battery monitoring and voltage SIG-certified module that provides a complete wireless sense solution with a Bluetooth stack, an integrated PCB antenna, and worldwide radio certifications in a • Built-in ADC for charger thermal protection compact surface-mount package. • Built-in Undervoltage Protection (UVP) The BM62/64 module has several SKUs. The BM62 • An auxiliary input port for external audio input module is a Class 2 device and the BM64 module is • Two LED drivers available in both Class 1 and Class 2 versions. • Multiple I/O pins for control and status
RF/Analog
• Frequency spectrum: 2.402 GHz to 2.480 GHz • Receive sensitivity: -90 dBm (2 Mbps EDR) • Outpu t Power - BM64 Class 1: +15 dBm typical - BM62/64 Class 2: +2 dBm typical
HCI Interface
• High-speed HCI-UART interface (supports up to 921,600 bps)
MAC/Baseband Processor
• Supports Bluetooth 5.0 dual-mode - BDR/EDR transport for audio, voice, and SPP data exchange - BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange
Operating Condition
• Operating voltage: 3.2V to 4.2V • Operating temperature: -20°C to +70°C
Compliance
• Bluetooth Special Interest Group (SIG) QDID: 110148 (BM62, BM64 Class 2) and 110159 (BM64 Class 1) • Certified to the United States (FCC), Innovation, Science and Economic Development Canada (ISED), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (MIC), China (SRRC), and Brazil (ANATEL) radio regulations
Applications
• Portable speaker • Multiple speakers • Headset DS60001403F-Page 2
Advanced
 2017-2020 Microchip Technology Inc. Document Outline Features DSP Audio Processing FIGURE 1: BM62 MODULE FIGURE 2: BM64 MODULE Audio Codec Peripherals RF/Analog HCI Interface MAC/Baseband Processor Operating Condition Compliance Applications Description Table of Contents Most Current Data Sheet Errata Customer Notification System 1.0 Device Overview FIGURE 1-1: SINGLE SPEAKER Application using BM62 Module FIGURE 1-2: SINGLE SPEAKER Application Using BM64 Module FIGURE 1-3: Multi-speaker application USING BM64 Module TABLE 1-1: BM62/64 KEY FEATURES FIGURE 1-4: BM62 Module PIN Diagram TABLE 1-2: BM62 Module PIN Description (Continued) FIGURE 1-5: bm64 Module pin diagram TABLE 1-3: BM64 Module PIN Description (Continued) 2.0 Audio 2.1 Digital Signal Processor FIGURE 2-1: Speech Signal Processing FIGURE 2-2: Audio Signal Processing 2.2 Codec FIGURE 2-3: CODEC DAC Dynamic Range FIGURE 2-4: CODEC DAC THD+N Versus input power FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC Frequency response (Single-EndED mode) 2.3 Auxiliary Port 2.4 Analog Speaker Output FIGURE 2-7: Analog speaker output Capless MODE FIGURE 2-8: Analog speaker output SINGLE-ENDed MODE 3.0 Transceiver 3.1 Transmitter 3.2 Receiver 3.3 Synthesizer 3.4 Modem 3.5 Adaptive Frequency Hopping (AFH) 4.0 Power Management Unit 4.1 Charging a Battery FIGURE 4-1: BATTERY CHARGING CURVE 4.2 Voltage Monitoring 4.3 LED Drivers FIGURE 4-2: LED Drivers 4.4 Under Voltage Protection (Software Dependent UVP) 4.5 Ambient Detection FIGURE 4-3: Ambient Detection 5.0 Application Information 5.1 Power Supply FIGURE 5-1: Power Tree DIAGRAM 5.2 Host MCU Interface FIGURE 5-2: HOST MCU INTERFACE OVER UART FIGURE 5-3: Power-On/Off Sequence FIGURE 5-4: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON State FIGURE 5-5: TIMING SEQUENCE OF POWER-OFF State FIGURE 5-6: TIMING SEQUENCE OF POWER-ON (NACK) FIGURE 5-7: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU FIGURE 5-8: TIMING SEQUENCE OF POWER DROP PROTECTION 5.2.1 Device FW Upgrade (DFU) FIGURE 5-9: Timing Diagram of Application Mode to DFU Mode FIGURE 5-10: Timing Diagram of DFU Mode to Application Mode 5.3 I2S Mode Application FIGURE 5-11: BM64 MODULE IN I2S MASTER MODE FIGURE 5-12: BM64 MODULE IN I2S SLAVE MODE 5.4 Reset 5.5 External Configuration and Programming FIGURE 5-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS TABLE 5-1: SYSTEM CONFIGURATION I/O PIN SETTINGS 5.6 Reference Circuit FIGURE 5-14: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-15: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-16: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-17: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-19: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-20: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-21: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION 6.0 Printed Antenna Information 6.1 Antenna Radiation Pattern FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN at 2441 MHz TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS 6.2 Module Placement Guidelines FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 7.0 Physical Dimensions FIGURE 7-1: BM62 Module PCB DIMENSION FIGURE 7-2: BM64 Module PCB DIMENSION FIGURE 7-3: RECOMMENDED BM62 Module PCB FOOTPRINT FIGURE 7-4: RECOMMENDED BM64 Module PCB FOOTPRINT 8.0 Electrical Characteristics TABLE 8-1: RECOMMENDED OPERATING CONDITION TABLE 8-2: I/O AND RESET LEVEL TABLE 8-3: BATTERY CHARGER TABLE 8-4: LED DRIVER TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION TABLE 8-10: BM64SPKS1MC2 EMBEDDED MODE (WITHOUT EXTERNAL MCU) SYSTEM CURRENT CONSUMPTION TABLE 8-11: BM64SPKS1MC2 HOST MCU MODE SYSTEM CURRENT CONSUMPTION 8.1 Timing specifications FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) FIGURE 8-3: AUDIO INTERFACE TIMING Diagram TABLE 8-12: AUDIO INTERFACE TIMING Specifications 9.0 Soldering Recommendations FIGURE 9-1: REFLOW PROFILE 10.0 Ordering Information TABLE 10-1: BM62/64 Module ORDERING INFORMATION Appendix A: Certification Notices TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2) TABLE A-2: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1) TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2) Appendix B: Revision History Revision A (May 2016) Revision B (December 2016) TABLE B-1: major Section Updates Revision C (October 2017) TABLE C-1: major Section Updates Revision D (March 2018) TABLE D-1: major Section Updates Revision E (September 2018) TABLE E-1: major Section Updates Revision F (June 2020) TABLE F-1: major Section Updates The 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