X9418 Datasheet (Renesas) - 19
| 制造商 | Renesas |
| 描述 | Low Noise/Low Power/2-Wire Bus |
| 页数 / 页 | 20 / 19 — Small Outline Plastic Packages (SOIC). M24.3. (JEDEC MS-013-AD ISSUE C). … |
| 修订版 | 2.00 |
| 文件格式/大小 | PDF / 841 Kb |
| 文件语言 | 英语 |
Small Outline Plastic Packages (SOIC). M24.3. (JEDEC MS-013-AD ISSUE C). 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE. INDEX
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文件文字版本
X9418
Small Outline Plastic Packages (SOIC) M24.3 N (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES MILLIMETERS E SYMBOL MIN MAX MIN MAX NOTES -B-
A 0.0926 0.1043 2.35 2.65 -
1 2 3
A1 0.0040 0.0118 0.10 0.30 -
L
B 0.013 0.020 0.33 0.51 9
SEATING PLANE
C 0.0091 0.0125 0.23 0.32 -
-A-
D 0.5985 0.6141 15.20 15.60 3
D A h x 45o
E 0.2914 0.2992 7.40 7.60 4
-C-
e 0.05 BSC 1.27 BSC -
µ
e
H 0.394 0.419 10.00 10.65 -
A1 C
h 0.010 0.029 0.25 0.75 5
B 0.10(0.004)
L 0.016 0.050 0.40 1.27 6
0.25(0.010) M C A M B S
N 24 24 7 NOTES: 0o 8o 0o 8o - 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Rev. 0 12/93 Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. FN8194 Rev 2.00 Page 19 of 20 October 12, 2006
Small Outline Plastic Packages (SOIC) M24.3 N (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES MILLIMETERS E SYMBOL MIN MAX MIN MAX NOTES -B-
A 0.0926 0.1043 2.35 2.65 -
1 2 3
A1 0.0040 0.0118 0.10 0.30 -
L
B 0.013 0.020 0.33 0.51 9
SEATING PLANE
C 0.0091 0.0125 0.23 0.32 -
-A-
D 0.5985 0.6141 15.20 15.60 3
D A h x 45o
E 0.2914 0.2992 7.40 7.60 4
-C-
e 0.05 BSC 1.27 BSC -
µ
e
H 0.394 0.419 10.00 10.65 -
A1 C
h 0.010 0.029 0.25 0.75 5
B 0.10(0.004)
L 0.016 0.050 0.40 1.27 6
0.25(0.010) M C A M B S
N 24 24 7 NOTES: 0o 8o 0o 8o - 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Rev. 0 12/93 Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. FN8194 Rev 2.00 Page 19 of 20 October 12, 2006