Datasheet Texas Instruments VCBUTA67TT1 — 数据表

制造商Texas Instruments
系列TMS320DM6467T
零件号VCBUTA67TT1
Datasheet Texas Instruments VCBUTA67TT1

数字媒体片上系统529-FCBGA 0至85

数据表

TMS320DM6467T Digital Media System-on-Chip datasheet
PDF, 2.1 Mb, 修订版: C, 档案已发布: Jul 11, 2012
从文件中提取

价格

状态

Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNo

打包

Pin529529
Package TypeZUTZUT
Industry STD TermFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Device MarkingTMS320DM6467TZUT1
Width (mm)1919
Length (mm)1919
Thickness (mm)2.652.65
Pitch (mm).8.8
Max Height (mm)3.33.3
Mechanical Data下载下载

参数化

ARM CPU1 ARM9
ARM MHz500 Max.
ApplicationsCommunications and Telecom,Consumer Electronics,Energy,Industrial,Security,Video and Imaging
DRAMDDR2
DSP1 C64x
DSP MHz1000 Max.
EMAC10/100/1000
I2C1
On-Chip L2 Cache128 KB (DSP)
Operating SystemsDSP/BIOS,Linux,VLX
Operating Temperature Range-40 to 85,0 to 85 C
PCI/PCIe1 32-Bit [66 MHz]
Pin/Package529FCBGA
RatingCatalog
SPI1
UART3 SCI
Video Acceleration2 HDVICPs
Video Port1 for Dual SD or Single HD Display,1 for Dual SD or Single HD or Single Raw Capture,VPIF Configurable
Video Resolution/Frame RateD1 or Less,720p,1080i/p

生态计划

RoHSNot Compliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • TMS320DM6467T Power Consumption Summary
    PDF, 132 Kb, 档案已发布: Nov 13, 2009
    This application report discusses the power consumption of the Texas Instruments TMS320DM6467T digital media System-on-Chip (DMSoC). Power consumption on the DM6467T device is highly application-dependent; therefore, a spreadsheet that estimates power consumption is provided along with this document. To obtain good results from the spreadsheet, realistic usage parameters must be entered (see Secti
  • Using the TMS320DM646x DMSoC Bootloader (Rev. D)
    PDF, 136 Kb, 修订版: D, 档案已发布: Mar 4, 2011
    This document describes the functionality of the TMS320DM6467 Digital Media System-on-Chip (DMSoC) ARM ROM bootloader (RBL) software. The ARM ROM bootloader resides in the ROM of the device beginning at address 0x00008000. The RBL implements methods for booting in the listed modes and uses boot configuration pins to determine boot mode. If an improper boot mode is chosen, or an error is detected d
  • PCI Express to TMS320DM646x PCI Interface Through XIO2000A Bridge
    PDF, 119 Kb, 档案已发布: Feb 3, 2009
    The Texas Instruments DM646x devices support interfacing to a peripheral component interconnect (PCI) bus through its PCI port. The system or the application may contain a PCI ExpressВ® interface. In order to connect the PCI Express bus to the DM646x PCI bus, an XIO2000A translation bridge is used. XIO2000A is a PCI Express to PCI/PCI-Xв„ў bus translation bridge.
  • Using the Video Port of TMS320DM646x (Rev. A)
    PDF, 181 Kb, 修订版: A, 档案已发布: Apr 6, 2010
    This application report has supplemental information about using the DM646x video port. The tips and tricks in this document are useful in video security applications as well as other applications that make use of the video port.
  • TMS320DM6467 to TMS320DM6467T Migration Guide (Rev. B)
    PDF, 40 Kb, 修订版: B, 档案已发布: Jun 8, 2010
    This application report describes an overview of the necessary changes to migrate a DM6467-based design from a DM6467 device (594 MHz or 729 MHz) to a DM6467T (1GHz) device. The DM6467T device requires the changes listed in this document for proper operation. Other system changes may be required to accommodate new speeds or capabilities in the system.
  • Multiple TMS320DM6467 PCI Interface
    PDF, 85 Kb, 档案已发布: Feb 10, 2009
    The DM6467 contains a PCI interface that allows connecting it to a PCI bus in order to communicate with the other peripherals in the system. The DM6467 PCI has a 32-bit data bus. The operating frequency is specified in the device-specific data sheet. This document shows different ways to interface DM6467 devices with the PCI bus.
  • Building a Small Embedded Linux Kernel Example (Rev. A)
    PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
    Building a Small Embedded Linux Kernel Example Application Report
  • Running a TMS320C64x+ Codec Across TMS320C64x+ Based DSP Platforms
    PDF, 969 Kb, 档案已发布: Sep 24, 2009
    This application report describes the device differences to be taken care for running the C64x+™ video codec software on different C64x+ based platforms. This document assumes that the codec software is developed for the C64x+ digital signal processor (DSP) core. As many TI platforms have a C64x+ DSP this document gives the details for running the standalone codec software on a C64x+ platfo
  • TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A)
    PDF, 310 Kb, 修订版: A, 档案已发布: Oct 20, 2005
    This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
  • Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
    PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
    This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
  • Thermal Considerations for the DM64xx, DM64x, and C6000 Devices
    PDF, 127 Kb, 档案已发布: May 20, 2007
    As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
  • Introduction to TMS320C6000 DSP Optimization
    PDF, 535 Kb, 档案已发布: Oct 6, 2011
    The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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  • Semiconductors > Processors > Digital Signal Processors > Media Processors > Digital Video Processors