Datasheet Texas Instruments HPA01085DBVR — 数据表

高PSRR，低噪声，200mA单输出LDO，5-SOT-23 -40至125

数据表

PDF, 1.2 Mb, 修订版: L, 档案已发布: Aug 7, 2014

从文件中提取

下载
NanoStarв„ў Wafer Chip-Scale Package Design Guide
PDF, 286 Kb, 档案已发布: Sep 5, 2003
To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE
下载
NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
PDF, 749 Kb, 档案已发布: Feb 2, 2004
The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
下载
Cycloneв„ў III FPGA Starter Kit Power Reference Design
PDF, 314 Kb, 档案已发布: Mar 27, 2008
This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.

系列: TPS793 (34)

HPA01085DBVR HPA01085DVBR TPS79301DBVR TPS79301DBVRG4 TPS79318DBVR TPS79318DBVRG4 TPS79318DBVT TPS79318DBVTG4 TPS79318YEQR TPS79318YEQT TPS79318YZQR TPS79318YZQT TPS79325DBVR TPS79325DBVRG4 TPS79325YEQR TPS79325YZQR TPS793285DBVR TPS793285DBVRG4 TPS793285DBVT TPS793285DBVTG4 TPS793285YZQR TPS79328DBVR TPS79328DBVRG4 TPS79328YEQR TPS79328YZQR TPS79328YZQT TPS79330DBVR TPS79330DBVRG4 TPS79330YZQR TPS79330YZQT TPS79333DBVR TPS79333DBVRG4 TPS793475DBVR TPS793475DBVRG4