Datasheet Texas Instruments TPS79325YZQR — 数据表

制造商Texas Instruments
系列TPS793
零件号TPS79325YZQR
Datasheet Texas Instruments TPS79325YZQR

高PSRR,低噪声,200mA单路输出LDO,5-DSBGA -40至125

数据表

TPS793 Low-Noise, High PSRR, RF, 200-mA Low-Dropout Linear Regulators in NanoStarв„ў Wafer Chip Scale and SOT-23 datasheet
PDF, 1.2 Mb, 修订版: L, 档案已发布: Aug 7, 2014
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin5
Package TypeYZQ
Industry STD TermDSBGA
JEDEC CodeR-XBGA-N
Package QTY3000
CarrierLARGE T&R
Device MarkingE4
Thickness (mm).45
Pitch (mm).5
Max Height (mm).6
Mechanical Data下载

参数化

Accuracy2 %
Fixed Output Options1.8,2.5,2.8,2.85,3,3.3,4.75 V
Iout(Max)0.2 A
Iq(Typ)0.17 mA
Noise32 uVrms
Operating Temperature Range-40 to 125 C
Output Capacitor TypeCeramic
Output OptionsAdjustable Output,Fixed Output
PSRR @ 100KHz44 dB
Package GroupDSBGA
Package Size: mm2:W x LSee datasheet (DSBGA) PKG
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Thermal Resistance ОёJA178 В°C/W
Vdo(Typ)112 mV
Vin(Max)5.5 V
Vin(Min)2.7 V
Vout(Max)5.4 V
Vout(Min)1.22 V

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: TMDXEVM368
    TMS320DM36x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS793285YEQEVM
    TPS793285Y Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79325YEQEVM
    Evaluation Module for TPS79325 chipscale LDO
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79330YEQEVM
    Evaluation Module for TPS79330 chipscale LDO
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79328EVM
    TPS79328 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79301EVM
    TPS79301 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: DEM-SOT23LDO
    DEM-SOT23LDO Compatible With Most Positive-Output LDO Regulators in 5- or 6-Lead SOT23 (DBV) Package
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • NanoStarв„ў Wafer Chip-Scale Package Design Guide
    PDF, 286 Kb, 档案已发布: Sep 5, 2003
    To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE
  • NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
    PDF, 749 Kb, 档案已发布: Feb 2, 2004
    The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
  • Cycloneв„ў III FPGA Starter Kit Power Reference Design
    PDF, 314 Kb, 档案已发布: Mar 27, 2008
    This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.

模型线

制造商分类

  • Semiconductors > Power Management > Linear Regulator (LDO) > Single Channel LDO