Package Intersil V416.27x27 — 数据表
416塑料球栅阵列封装(下腔)
Package Outline Drawing (POD)
参数化
| Family | PBGA | 
| Pin Count | 416 | 
| Weight | 2.28 g | 
| Pitch | 25.40 mm | 
| Peak Temperature | 235 °C | 
| Lead Free Peak Temperature | 260 °C | 
| Features | Plastic | 
| Package Index | V416.27X27 | 
模型线
系列: BGA (14)
制造商分类
- Plastic Packages
