Package Intersil V256.13.5x13.5 — 数据表

制造商Intersil
系列BGA
零件号V256.13.5x13.5
Package Intersil V256.13.5x13.5

256薄型,小间距塑料球栅阵列封装

Package Outline Drawing (POD)

PDF, 211 Kb
从文件中提取

参数化

FamilyLFBGA
Pin Count256
Height max1.70 mm
Weight0.722 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile, Fine
Package IndexV256.13.5X13.5

模型线

制造商分类

  • Plastic Packages