Package Intersil V352.27x27 — 数据表
352塑料球栅阵列封装
Package Outline Drawing (POD)
参数化
| Family | BGA |
| Pin Count | 352 |
| Weight | 2.28 g |
| Pitch | 1.00 mm |
| Peak Temperature | 235 °C |
| Lead Free Peak Temperature | 260 °C |
| Package Index | V352.27X27 |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages
