Package Intersil V352.27x27 — 数据表
352塑料球栅阵列封装
Package Outline Drawing (POD)
参数化
| Family | BGA | 
| Pin Count | 352 | 
| Weight | 2.28 g | 
| Pitch | 1.00 mm | 
| Peak Temperature | 235 °C | 
| Lead Free Peak Temperature | 260 °C | 
| Package Index | V352.27X27 | 
模型线
系列: BGA (14)
制造商分类
- Plastic Packages
