Package Intersil V256.17x17 — 数据表
256个塑料球栅阵列封装
Package Outline Drawing (POD)
参数化
| Family | FBGA |
| Pin Count | 256 |
| Length | 17.00 mm |
| Width | 17.00 mm |
| Thickness | 1.03 mm |
| Height max | 1.50 mm |
| Weight | 0.705 g |
| Pitch | 1.00 mm |
| Peak Temperature | 240 °C |
| Lead Free Peak Temperature | 260 °C |
| Features | Fine |
| Package Index | V256.17X17 |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages