Package Intersil V100.11x11 — 数据表
100塑料球栅阵列封装
Package Outline Drawing (POD)
参数化
| Family | FBGA |
| Pin Count | 100 |
| Length | 11.00 mm |
| Width | 11.00 mm |
| Peak Temperature | 240 °C |
| Features | Fine |
| Package Index | V100.11X11 |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages
100塑料球栅阵列封装
| Family | FBGA |
| Pin Count | 100 |
| Length | 11.00 mm |
| Width | 11.00 mm |
| Peak Temperature | 240 °C |
| Features | Fine |
| Package Index | V100.11X11 |