Datasheet Texas Instruments TMS320C6678 — 数据表

制造商Texas Instruments
系列TMS320C6678
Datasheet Texas Instruments TMS320C6678

多核定点和浮点数字信号处理器

数据表

TMS320C6678 Multicore Fixed and Floating-Point Digital Signal Processor datasheet
PDF, 2.2 Mb, 修订版: E, 档案已发布: Mar 6, 2014
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价格

状态

TMS320C6678ACYPTMS320C6678ACYP25TMS320C6678ACYP4TMS320C6678ACYPATMS320C6678ACYPA25TMS320C6678AGYPATMS320C6678AXCYPTMS320C6678AXCYP25TMS320C6678AXCYPA
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNoNoNoNoYesNoYesYes

打包

TMS320C6678ACYPTMS320C6678ACYP25TMS320C6678ACYP4TMS320C6678ACYPATMS320C6678ACYPA25TMS320C6678AGYPATMS320C6678AXCYPTMS320C6678AXCYP25TMS320C6678AXCYPA
N123456789
Pin841841841841841841841841841
Package TypeCYPCYPCYPCYPCYPGYPCYPCYPCYP
Package QTY444444444444444444
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking@2010 TI1.25GHZTMS320C6678CYPTMS320C6678CYP@2010 TIA@2010 TI@2010 TIA
Width (mm)242424242424242424
Length (mm)242424242424242424
Thickness (mm)2.822.822.822.822.822.812.822.822.82
Mechanical Data下载下载下载下载下载下载下载下载下载

参数化

Parameters / ModelsTMS320C6678ACYP
TMS320C6678ACYP
TMS320C6678ACYP25
TMS320C6678ACYP25
TMS320C6678ACYP4
TMS320C6678ACYP4
TMS320C6678ACYPA
TMS320C6678ACYPA
TMS320C6678ACYPA25
TMS320C6678ACYPA25
TMS320C6678AGYPA
TMS320C6678AGYPA
TMS320C6678AXCYP
TMS320C6678AXCYP
TMS320C6678AXCYP25
TMS320C6678AXCYP25
TMS320C6678AXCYPA
TMS320C6678AXCYPA
ApplicationsCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and TelecomCommunications and Telecom
DRAMDDR3DDR3DDR3DDR3DDR3DDR3DDR3DDR3DDR3
DSP8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x
DSP MHz, Max.1000,12501000,12501000,12501000,12501000,12501000,12501000,12501000,12501000,1250
EMAC2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch
GFLOPS128,160128,160128,160128,160128,160128,160128,160128,160128,160
On-Chip L2 Cache4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB
Operating Temperature Range, C-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85-40 to 100,0 to 85
Other On-Chip Memory4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB4096 KB
PCI/PCIe2 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen2
Package Size: mm2:W x L, PKGSee datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)See datasheet (FCBGA)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Serial I/OI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UARTI2C,RapidIO,SPI,TSIP,UART
Serial RapidIO1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)1 (four lanes)
Total On-Chip Memory, KB883288328832883288328832883288328832

生态计划

TMS320C6678ACYPTMS320C6678ACYP25TMS320C6678ACYP4TMS320C6678ACYPATMS320C6678ACYPA25TMS320C6678AGYPATMS320C6678AXCYPTMS320C6678AXCYP25TMS320C6678AXCYPA
RoHSCompliantCompliantCompliantCompliantCompliantSee ti.comCompliantCompliantCompliant

应用须知

  • PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
    PDF, 57 Kb, 修订版: A, 档案已发布: May 19, 2017
  • Keystone NDK FAQ
    PDF, 54 Kb, 档案已发布: Oct 3, 2016
    This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
  • TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
    PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
  • TI Keystone DSP PCIe SerDes IBIS-AMI Models
    PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
  • SerDes Implementation Guidelines for KeyStone I Devices
    PDF, 590 Kb, 档案已发布: Oct 31, 2012
    The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
  • Hardware Design Guide for KeyStone Devices (Rev. C)
    PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
  • KeyStone I DDR3 Initialization (Rev. E)
    PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
    The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
  • TMS320C66x DSP Generation of Devices (Rev. A)
    PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, 档案已发布: Dec 13, 2011
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, 档案已发布: Nov 9, 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015

模型线

制造商分类

  • Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP