Datasheet Texas Instruments TMS320C6671 — 数据表

制造商	Texas Instruments
系列	TMS320C6671

数据表

价格

状态

打包

参数化

Parameters / Models	TMS320C6671ACYP	TMS320C6671ACYP25	TMS320C6671ACYPA	TMS320C6671ACYPA25
Applications	Communications and Telecom	Communications and Telecom	Communications and Telecom	Communications and Telecom
DRAM	DDR3	DDR3	DDR3	DDR3
DSP	1 C66x	1 C66x	1 C66x	1 C66x
DSP MHz, Max.	1000,1250	1000,1250	1000,1250	1000,1250
EMAC	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch
GFLOPS	16,20	16,20	16,20	16,20
On-Chip L2 Cache	512 KB	512 KB	512 KB	512 KB
Operating Temperature Range, C	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85
Other On-Chip Memory	4096 KB	4096 KB	4096 KB	4096 KB
PCI/PCIe	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2
Package Size: mm2:W x L, PKG	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)
Rating	Catalog	Catalog	Catalog	Catalog
Serial I/O	I2C,RapidIO,SPI,TSIP,UART	I2C,RapidIO,SPI,TSIP,UART	I2C,RapidIO,SPI,TSIP,UART	I2C,RapidIO,SPI,TSIP,UART
Serial RapidIO	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)
Total On-Chip Memory, KB	4800	4800	4800	4800

生态计划

应用须知

• 下载
  TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
  PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
• 下载
  TI Keystone DSP PCIe SerDes IBIS-AMI Models
  PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
• 下载
  SerDes Implementation Guidelines for KeyStone I Devices
  PDF, 590 Kb, 档案已发布: Oct 31, 2012
  The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
• 下载
  KeyStone I DDR3 Initialization (Rev. E)
  PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
  The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
• 下载
  TMS320C66x DSP Generation of Devices (Rev. A)
  PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
• 下载
  Hardware Design Guide for KeyStone Devices (Rev. C)
  PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
• 下载
  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Kb, 档案已发布: Apr 13, 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
• 下载
  PCIe Use Cases for KeyStone Devices
  PDF, 320 Kb, 档案已发布: Dec 13, 2011
• 下载
  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
• 下载
  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
• 下载
  Optimizing Loops on the C66x DSP
  PDF, 585 Kb, 档案已发布: Nov 9, 2010
• 下载
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
• 下载
  Multicore Programming Guide (Rev. B)
  PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
  As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
• 下载
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require

模型线

制造商分类

• Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP