Datasheet Texas Instruments SN74CBT16390 — 数据表

制造商Texas Instruments
系列SN74CBT16390
Datasheet Texas Instruments SN74CBT16390

16位至32位FET多路复用器/多路解复用器总线开关

数据表

16-Bit To 32-Bit FET Multiplexer/Demultiplexer Bus Switch datasheet
PDF, 331 Kb, 修订版: E, 档案已发布: Oct 23, 2000
从文件中提取

价格

状态

SN74CBT16390DGGRSN74CBT16390DGVRSN74CBT16390DLSN74CBT16390DLG4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

打包

SN74CBT16390DGGRSN74CBT16390DGVRSN74CBT16390DLSN74CBT16390DLG4
N1234
Pin56565656
Package TypeDGGDGVDLDL
Industry STD TermTSSOPTVSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200020002020
CarrierLARGE T&RLARGE T&RTUBETUBE
Device MarkingCBT16390CY390CBT16390CBT16390
Width (mm)6.14.47.497.49
Length (mm)1411.318.4118.41
Thickness (mm)1.151.052.592.59
Pitch (mm).5.4.635.635
Max Height (mm)1.21.22.792.79
Mechanical Data下载下载下载下载

参数化

Parameters / ModelsSN74CBT16390DGGR
SN74CBT16390DGGR
SN74CBT16390DGVR
SN74CBT16390DGVR
SN74CBT16390DL
SN74CBT16390DL
SN74CBT16390DLG4
SN74CBT16390DLG4
Additional FeaturesInternal pull-down resistors,Make-before-breakInternal pull-down resistors,Make-before-breakInternal pull-down resistors,Make-before-breakInternal pull-down resistors,Make-before-break
Bandwidth, MHz200200200200
Bandwidth(Max), MHz200200200200
Configuration2:1 SPDT2:1 SPDT2:1 SPDT2:1 SPDT
ESD HBM, kV2222
Input/Ouput Voltage(Max), V5.55.55.55.5
Input/Output Continuous Current(Max), mA128128128128
Input/Output OFF-state Capacitance(Typ), pF5.55.55.55.5
Number of Channels16161616
OFF-state leakage current(Max), µA1111
ON-state leakage current(Max), µA1111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTVSOPSSOPSSOP
Package Size: mm2:W x L, PKG56TSSOP: 113 mm2: 8.1 x 14(TSSOP)56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
RatingCatalogCatalogCatalogCatalog
Ron(Max), Ohms12121212
Ron(Typ), Ohms5555
Supply Current(Max), uA50505050
Supply Range, Max5.55.55.55.5
VIH(Min), V2222
VIL(Max), V0.80.80.80.8
Vdd(Max), V5.55.55.55.5
Vdd(Min), V4.54.54.54.5
Vss(Max), VN/AN/AN/AN/A
Vss(Min), VN/AN/AN/AN/A

生态计划

SN74CBT16390DGGRSN74CBT16390DGVRSN74CBT16390DLSN74CBT16390DLG4
RoHSCompliantCompliantCompliantCompliant

应用须知

  • Flexible Voltage-Level Translation With CBT Family Devices
    PDF, 40 Kb, 档案已发布: Jul 20, 1999
    Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
  • 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
    PDF, 35 Kb, 修订版: B, 档案已发布: Mar 1, 1997
    The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
  • 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
    PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
  • VOLTAGE LEVEL TRANSLATION (SL) - Family
    PDF, 111 Kb, 档案已发布: Sep 21, 2011
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, 档案已发布: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

模型线

制造商分类

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes