Datasheet Texas Instruments SN74CBT16390 — 数据表

制造商	Texas Instruments
系列	SN74CBT16390

数据表

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参数化

Parameters / Models	SN74CBT16390DGGR	SN74CBT16390DGVR	SN74CBT16390DL	SN74CBT16390DLG4
Additional Features	Internal pull-down resistors,Make-before-break	Internal pull-down resistors,Make-before-break	Internal pull-down resistors,Make-before-break	Internal pull-down resistors,Make-before-break
Bandwidth, MHz	200	200	200	200
Bandwidth(Max), MHz	200	200	200	200
Configuration	2:1 SPDT	2:1 SPDT	2:1 SPDT	2:1 SPDT
ESD HBM, kV	2	2	2	2
Input/Ouput Voltage(Max), V	5.5	5.5	5.5	5.5
Input/Output Continuous Current(Max), mA	128	128	128	128
Input/Output OFF-state Capacitance(Typ), pF	5.5	5.5	5.5	5.5
Number of Channels	16	16	16	16
OFF-state leakage current(Max), µA	1	1	1	1
ON-state leakage current(Max), µA	1	1	1	1
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	TSSOP	TVSOP	SSOP	SSOP
Package Size: mm2:W x L, PKG	56TSSOP: 113 mm2: 8.1 x 14(TSSOP)	56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP)	56SSOP: 191 mm2: 10.35 x 18.42(SSOP)	56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
Rating	Catalog	Catalog	Catalog	Catalog
Ron(Max), Ohms	12	12	12	12
Ron(Typ), Ohms	5	5	5	5
Supply Current(Max), uA	50	50	50	50
Supply Range, Max	5.5	5.5	5.5	5.5
VIH(Min), V	2	2	2	2
VIL(Max), V	0.8	0.8	0.8	0.8
Vdd(Max), V	5.5	5.5	5.5	5.5
Vdd(Min), V	4.5	4.5	4.5	4.5
Vss(Max), V	N/A	N/A	N/A	N/A
Vss(Min), V	N/A	N/A	N/A	N/A

生态计划

应用须知

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  PDF, 40 Kb, 档案已发布: Jul 20, 1999
  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
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  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
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  3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
  PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
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  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
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  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

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• Semiconductors> Switches and Multiplexers> Analog Switches/Muxes