Datasheet Texas Instruments LMR10530 — 数据表

制造商	Texas Instruments
系列	LMR10530

数据表

价格

状态

打包

参数化

Parameters / Models	LMR10530XSD/NOPB	LMR10530XSDX/NOPB	LMR10530YSD/NOPB	LMR10530YSDX/NOPB
Control Mode	Current Mode	Current Mode	Current Mode	Current Mode
Duty Cycle(Max), %	90	90	90	90
Iout(Max), A	3	3	3	3
Iq(Typ), mA	3.2	3.2	3.2	3.2
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	WSON	WSON	WSON	WSON
Rating	Catalog	Catalog	Catalog	Catalog
Regulated Outputs	1	1	1	1
Special Features	Enable	Enable	Enable	Enable
Switching Frequency(Max), kHz	3750	3750	3750	3750
Switching Frequency(Min), kHz	1600	1600	1600	1600
Type	Converter	Converter	Converter	Converter
Vin(Max), V	5.5	5.5	5.5	5.5
Vin(Min), V	3	3	3	3
Vout(Max), V	4.5	4.5	4.5	4.5
Vout(Min), V	0.6	0.6	0.6	0.6

生态计划

应用须知

• 下载
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, 修订版: B, 档案已发布: Aug 24, 2018
• 下载
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• 下载
  Input and Output Capacitor Selection
  PDF, 219 Kb, 档案已发布: Sep 19, 2005
• 下载
  AN-1197 Selecting Inductors for Buck Converters (Rev. B)
  PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
  This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
• 下载
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• 下载
  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
• 下载
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• 下载
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
• 下载
  Absolute Maximum Ratings for Soldering (Rev. D)
  PDF, 52 Kb, 修订版: D, 档案已发布: Jun 9, 2016
• 下载
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• 下载
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• 下载
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• 下载
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

制造商分类

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)